74LVTH573WM
Manufacturer No:
74LVTH573WM
Manufacturer:
Description:
IC D-TYPE TRANSP SGL 8:8 20SOIC
Datasheet:
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In Stock : 13944
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74LVTH573WM Specifications
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TypeParameter
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Supplier Device Package20-SOIC
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Package / Case20-SOIC (0.295", 7.50mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C
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Current - Output High, Low32mA, 64mA
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Delay Time - Propagation4.4ns
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Independent Circuits1
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Voltage - Supply2.7V ~ 3.6V
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Output TypeTri-State
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Circuit8:8
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Logic TypeD-Type Transparent Latch
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PackagingTube
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Product StatusObsolete
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Series74LVTH
The 74LVTH573WM is an integrated circuit chip, specifically a octal transparent latch with 3-state outputs. Some of the advantages and application scenarios of this chip include:1. High-speed operation: The 74LVTH573WM chip is designed for high-speed operation, allowing for faster latch and output operations.2. Low voltage operation: The chip operates at low voltage levels, typically between 2.7V to 3.6V, making it suitable for low-power applications.3. 3-state outputs: The chip has 3-state outputs, which means the outputs can be disabled or set to a high-impedance state. This feature allows for greater flexibility in connecting multiple devices to a shared bus.4. Octal configuration: The chip has eight latch inputs and outputs, making it suitable for applications that require the storage and retrieval of multiple bits of data simultaneously.5. Data latching: The chip can latch input data based on a control signal, ensuring the stability of stored data until the latch is updated.6. Buffering: The chip employs buffer circuits between the internal latch and the outputs, providing signal conditioning and driving capability to connect to external devices.Application scenarios for the 74LVTH573WM chip can include:1. Data storage: The chip can be used to store and retrieve multiple bits of data simultaneously in applications such as memory subsystems or data buses.2. Serial-to-parallel conversion: The chip can be used to convert a serial stream of data into parallel data, which is useful in applications such as communication protocols.3. Bus sharing: The 3-state outputs of the chip can be utilized for bus sharing and control, allowing multiple devices to connect to a common data bus.4. Address decoding: The chip can be employed in address decoding circuits to enable or disable specific sections of memory or peripheral devices.5. Buffering and signal conditioning: The chip's buffer circuits can be used to amplify or condition signals, ensuring that they meet the requirements of the connected devices.Overall, the 74LVTH573WM chip provides high-speed, low voltage, and flexible latch and output functionality, making it suitable for various digital design applications.
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