BU4011BFV-E2
Manufacturer No:
BU4011BFV-E2
Description:
IC GATE NAND 4CH 2-INP 14SSOPB
Datasheet:
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BU4011BFV-E2 Specifications
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TypeParameter
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Package / Case14-LSSOP (0.173", 4.40mm Width)
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Supplier Device Package14-SSOP-B
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C
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Max Propagation Delay @ V, Max CL40ns @ 15V, 50pF
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Input Logic Level - High3.5V ~ 11V
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Input Logic Level - Low1.5V ~ 4V
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Current - Output High, Low1.2mA, 3mA
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Current - Quiescent (Max)4 µA
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Voltage - Supply3V ~ 16V
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Features-
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Number of Inputs2
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Number of Circuits4
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Logic TypeNAND Gate
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusNot For New Designs
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Series4000B
The BU4011BFV-E2 is a specific integrated circuit (IC) chip, and without detailed information about its specifications and purpose, it is challenging to provide specific advantages and application scenarios. However, in general, IC chips offer several advantages:1. Miniaturization: IC chips are compact and can integrate multiple electronic components onto a single chip, reducing the size and complexity of electronic devices.2. Power Efficiency: IC chips are designed to be power-efficient, allowing devices to operate for longer periods without draining the battery quickly.3. Reliability: IC chips are manufactured using advanced processes, ensuring high reliability and consistent performance.4. Cost-effectiveness: Mass production of IC chips reduces manufacturing costs, making them more affordable for various applications.Regarding application scenarios, IC chips are used in a wide range of electronic devices, including computers, smartphones, televisions, automotive systems, medical equipment, and more. Each specific IC chip is designed for a particular purpose, such as microcontrollers, memory chips, amplifiers, sensors, or communication modules. To provide more specific information about the BU4011BFV-E2 chip, it would be helpful to have additional details about its intended use or specifications.
BU4011BFV-E2 Relevant information