74LVC3G06GN,115

74LVC3G06GN,115

Manufacturer No:

74LVC3G06GN,115

Manufacturer:

Nexperia USA Inc.

Description:

IC INVERTER OD 3CH 3-INP 8XSON

Datasheet:

Datasheet

Delivery:

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74LVC3G06GN,115 Specifications

  • Type
    Parameter
  • Package / Case
    8-XFDFN
  • Supplier Device Package
    8-XSON (1.2x1)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Max Propagation Delay @ V, Max CL
    2.9ns @ 5V, 50pF
  • Input Logic Level - High
    1.7V ~ 2V
  • Input Logic Level - Low
    0.7V ~ 0.8V
  • Current - Output High, Low
    -, 32mA
  • Current - Quiescent (Max)
    4 µA
  • Voltage - Supply
    1.65V ~ 5.5V
  • Features
    Open Drain
  • Number of Inputs
    3
  • Number of Circuits
    3
  • Logic Type
    Inverter
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74LVC
The 74LVC3G06GN,115 is a triple inverter with open-drain outputs integrated circuit chip. Some advantages and application scenarios of this chip are:Advantages: 1. Low power consumption: The chip operates at a low voltage and consumes very little power, making it suitable for battery-powered devices and low-power applications. 2. Wide operating voltage range: It can operate within a wide voltage range, typically from 1.65V to 5.5V, allowing compatibility with various voltage levels. 3. High-speed operation: The chip has a high-speed propagation delay, enabling fast switching and signal processing. 4. Open-drain outputs: The open-drain outputs allow for easy interfacing with other devices and can be used for wired-OR configurations or bus line driving.Application scenarios: 1. Level shifting: The chip can be used to shift logic levels between different voltage domains, enabling communication between devices operating at different voltage levels. 2. Signal inversion: It can be used to invert logic signals, converting a high-level signal to a low-level signal or vice versa. 3. Bus line driving: The open-drain outputs of the chip make it suitable for driving bus lines in multi-master or multi-slave communication systems. 4. Wired-OR configurations: The open-drain outputs can be connected together in a wired-OR configuration, allowing multiple devices to share a common signal line. 5. Buffering and signal conditioning: The chip can be used to buffer and condition signals, ensuring proper signal integrity and compatibility between different parts of a circuit.Overall, the 74LVC3G06GN,115 chip offers low power consumption, wide voltage range, high-speed operation, and open-drain outputs, making it suitable for various applications requiring level shifting, signal inversion, bus line driving, and signal conditioning.