74AUP1G38GN,132

74AUP1G38GN,132

Manufacturer No:

74AUP1G38GN,132

Manufacturer:

Nexperia USA Inc.

Description:

IC GATE NAND OD 1CH 2-INP 6XSON

Datasheet:

Datasheet

Delivery:

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74AUP1G38GN,132 Specifications

  • Type
    Parameter
  • Package / Case
    6-XFDFN
  • Supplier Device Package
    6-XSON (0.9x1)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Max Propagation Delay @ V, Max CL
    12.7ns @ 3.3V, 30pF
  • Input Logic Level - High
    1.6V ~ 2V
  • Input Logic Level - Low
    0.7V ~ 0.9V
  • Current - Output High, Low
    -, 4mA
  • Current - Quiescent (Max)
    500 nA
  • Voltage - Supply
    0.8V ~ 3.6V
  • Features
    Open Drain
  • Number of Inputs
    2
  • Number of Circuits
    1
  • Logic Type
    NAND Gate
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74AUP
The 74AUP1G38GN,132 is a single 2-input NAND gate integrated circuit chip. Here are the advantages and application scenarios of this chip:Advantages: 1. Low power consumption: The 74AUP1G38GN,132 operates at a low supply voltage range of 0.8V to 3.6V, making it suitable for battery-powered devices and low-power applications. 2. High-speed operation: It has a high-speed propagation delay of 2.5 ns, enabling quick response times in digital circuits. 3. Small package size: The chip is available in a small SOT353 package, which saves board space and allows for compact designs. 4. Wide operating temperature range: It can operate in a temperature range of -40°C to 125°C, making it suitable for various environmental conditions.Application scenarios: 1. Logic gates: The 74AUP1G38GN,132 can be used as a basic building block for constructing various logic functions. It can be combined with other logic gates to implement complex digital circuits. 2. Signal conditioning: It can be used for signal conditioning and level shifting applications, where it converts and adjusts input signals to match the requirements of downstream components. 3. Buffering: The chip can be used as a buffer to isolate and amplify signals, ensuring proper signal integrity and preventing signal degradation. 4. Voltage level translation: It can be used for voltage level translation between different voltage domains in mixed-signal systems, allowing communication between components operating at different voltage levels. 5. Portable devices: Due to its low power consumption and small package size, the chip is suitable for use in portable devices such as smartphones, tablets, and wearable electronics.Overall, the 74AUP1G38GN,132 offers low power consumption, high-speed operation, and small package size, making it a versatile choice for various digital and mixed-signal applications.