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74LVC1G06GW-Q100H

74LVC1G06GW-Q100H

Manufacturer No:

74LVC1G06GW-Q100H

Manufacturer:

Nexperia USA Inc.

Description:

IC BUFFER INVERT 5.5V 5TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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74LVC1G06GW-Q100H Specifications

  • Type
    Parameter
  • Package / Case
    5-TSSOP, SC-70-5, SOT-353
  • Supplier Device Package
    5-TSSOP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Max Propagation Delay @ V, Max CL
    4ns @ 5V, 50pF
  • Input Logic Level - High
    1.07V ~ 3.85V
  • Input Logic Level - Low
    0.58V ~ 1.65V
  • Current - Output High, Low
    -, 32mA
  • Current - Quiescent (Max)
    200 µA
  • Voltage - Supply
    1.65V ~ 5.5V
  • Features
    Open Drain
  • Number of Inputs
    1
  • Number of Circuits
    1
  • Logic Type
    Inverter
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100, 74LVC
The SIM3U157-B-GQ integrated circuit chip is a highly integrated power management IC (PMIC) designed for use in mobile devices and other portable applications. Some of the advantages and application scenarios of this chip are:1. High Integration: The SIM3U157-B-GQ chip integrates multiple power management functions into a single chip, reducing the overall component count and PCB space required. This makes it suitable for compact and space-constrained devices.2. Power Efficiency: The chip incorporates advanced power management techniques, such as low-power modes and dynamic voltage scaling, to optimize power consumption and improve battery life in mobile devices.3. Multiple Power Rails: It provides multiple power rails with different voltage levels, allowing efficient power distribution to various components of the device, such as processors, memory, display, and wireless modules.4. Protection Features: The chip includes various protection features like overvoltage protection, overcurrent protection, and thermal shutdown, ensuring the safety and reliability of the device.5. Flexible Configuration: The chip offers programmable voltage levels and current limits, allowing customization and optimization for different device requirements.6. Wide Application Range: The SIM3U157-B-GQ chip is suitable for a wide range of portable devices, including smartphones, tablets, wearable devices, portable media players, and IoT devices.7. Cost-Effective Solution: The integration of multiple power management functions into a single chip reduces the overall system cost by eliminating the need for additional discrete components.8. Easy Design Integration: The chip is designed to be easily integrated into existing device designs, with support for standard communication interfaces and compatibility with various microcontrollers and processors.Overall, the SIM3U157-B-GQ integrated circuit chip offers advantages such as high integration, power efficiency, protection features, and flexibility, making it a suitable choice for various portable device applications.
74LVC1G06GW-Q100H Relevant information