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74AUP1GU04GM,115

74AUP1GU04GM,115

Manufacturer No:

74AUP1GU04GM,115

Manufacturer:

NXP USA Inc.

Description:

IC UNBUFFERED INVERTER LP 6-XSON

Datasheet:

Datasheet

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74AUP1GU04GM,115 Specifications

  • Type
    Parameter
  • Package / Case
    6-XFDFN
  • Supplier Device Package
    6-XSON, SOT886 (1.45x1)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Max Propagation Delay @ V, Max CL
    4.3ns @ 3.3V, 30pF
  • Input Logic Level - High
    -
  • Input Logic Level - Low
    -
  • Current - Output High, Low
    4mA, 4mA
  • Current - Quiescent (Max)
    500 nA
  • Voltage - Supply
    0.8V ~ 3.6V
  • Features
    -
  • Number of Inputs
    1
  • Number of Circuits
    1
  • Logic Type
    Inverter
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    74AUP
The 74AUP1GU04GM,115 is a single inverter gate integrated circuit chip. Some of its advantages and application scenarios are as follows:Advantages: 1. Low power consumption: The 74AUP1GU04GM,115 operates at a low supply voltage, typically 0.8V, which results in low power consumption. 2. High-speed operation: It has a high-speed propagation delay, making it suitable for applications that require fast switching. 3. Wide operating voltage range: The chip can operate within a wide voltage range, typically from 0.8V to 3.6V, making it compatible with various power supply levels. 4. Small package size: The chip is available in a small package, such as SOT353, which makes it suitable for space-constrained applications.Application scenarios: 1. Battery-powered devices: Due to its low power consumption, the 74AUP1GU04GM,115 is suitable for battery-powered devices, such as portable electronics, where power efficiency is crucial. 2. Low-voltage applications: The chip's ability to operate at low supply voltages makes it suitable for low-voltage applications, such as mobile phones, tablets, and other portable devices. 3. High-speed digital systems: The high-speed operation of the chip makes it suitable for use in high-speed digital systems, such as data communication interfaces, where fast switching is required. 4. Space-constrained applications: The small package size of the chip makes it suitable for applications with limited board space, such as wearable devices, IoT devices, and other compact electronic systems.It is important to note that the specific advantages and application scenarios may vary depending on the overall system requirements and design considerations.
74AUP1GU04GM,115 Relevant information