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74LVC332DBJ

74LVC332DBJ

Manufacturer No:

74LVC332DBJ

Manufacturer:

NXP USA Inc.

Description:

IC GATE OR 3CH 3-INP 14SSOP

Datasheet:

Datasheet

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74LVC332DBJ Specifications

  • Type
    Parameter
  • Package / Case
    14-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package
    14-SSOP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Max Propagation Delay @ V, Max CL
    5.9ns @ 3.3V, 50pF
  • Input Logic Level - High
    1.08V ~ 2V
  • Input Logic Level - Low
    0.12V ~ 0.8V
  • Current - Output High, Low
    24mA, 24mA
  • Current - Quiescent (Max)
    10 µA
  • Voltage - Supply
    1.65V ~ 3.6V
  • Features
    -
  • Number of Inputs
    3
  • Number of Circuits
    3
  • Logic Type
    OR Gate
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    74LVC
The 74LVC332DBJ is a specific model of integrated circuit chip, which is a 3-bit dual supply translating transceiver. Here are some advantages and application scenarios of this chip:Advantages: 1. Dual supply voltage compatibility: The 74LVC332DBJ chip is designed to work with both 3.3V and 5V supply voltages, making it versatile and compatible with a wide range of systems. 2. Bidirectional data transfer: It supports bidirectional data transfer, allowing for communication between different voltage domains. 3. Level shifting: The chip provides level shifting functionality, enabling communication between devices operating at different voltage levels. 4. High-speed operation: The 74LVC332DBJ chip is capable of high-speed data transfer, making it suitable for applications that require fast communication.Application scenarios: 1. Voltage level translation: The chip can be used to interface between devices operating at different voltage levels. For example, it can be used to connect a 3.3V microcontroller to a 5V peripheral device. 2. Mixed voltage systems: In systems where different components operate at different voltage levels, the 74LVC332DBJ chip can be used to facilitate communication between these components. 3. Bus communication: The chip can be used in bus communication scenarios, where multiple devices need to communicate with each other using a shared bus. 4. Logic level conversion: It can be used to convert logic levels between different voltage domains, ensuring compatibility between different parts of a system.These are just a few examples of the advantages and application scenarios of the 74LVC332DBJ integrated circuit chip. The specific use cases may vary depending on the requirements of the system or project.
74LVC332DBJ Relevant information