74LVC1G32QSE-7

74LVC1G32QSE-7

Manufacturer No:

74LVC1G32QSE-7

Manufacturer:

Diodes Incorporated

Description:

IC GATE OR 1CH 2-INP SOT353

Datasheet:

Datasheet

Delivery:

Payment:

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74LVC1G32QSE-7 Specifications

  • Type
    Parameter
  • Package / Case
    5-TSSOP, SC-70-5, SOT-353
  • Supplier Device Package
    SOT-353
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Max Propagation Delay @ V, Max CL
    5.5ns @ 5V, 50pF
  • Input Logic Level - High
    0.95V ~ 3.4V
  • Input Logic Level - Low
    0.7V ~ 0.8V
  • Current - Output High, Low
    32mA, 32mA
  • Current - Quiescent (Max)
    4 µA
  • Voltage - Supply
    1.65V ~ 5.5V
  • Features
    -
  • Number of Inputs
    2
  • Number of Circuits
    1
  • Logic Type
    OR Gate
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100, 74LVC
The 74LVC1G32QSE-7 is a single 2-input OR gate integrated circuit chip. Some advantages and application scenarios of this chip are:Advantages: 1. Small package size: The chip comes in a small SOT353 package, making it suitable for applications with limited space. 2. Low power consumption: The chip operates at low power supply voltage and consumes very low power, making it suitable for battery-powered devices. 3. High-speed operation: The chip has a high-speed operation with a propagation delay of only a few nanoseconds, making it suitable for applications requiring fast response times. 4. Wide operating voltage range: The chip can operate over a wide voltage range, typically from 1.65V to 5.5V, making it compatible with various logic families and voltage levels.Application scenarios: 1. Digital logic circuits: The chip can be used in various digital logic circuits where OR gate functionality is required. It can be used to combine multiple input signals and generate an output signal based on the logical OR operation. 2. Signal conditioning: The chip can be used for signal conditioning applications, where it can combine or merge multiple input signals into a single output signal. 3. Data transmission: The chip can be used in data transmission applications, where it can be used to combine or merge multiple data signals before transmitting them to a receiver. 4. Interface circuits: The chip can be used in interface circuits to convert and combine different logic levels or signals from different sources. 5. Battery-powered devices: Due to its low power consumption, the chip is suitable for use in battery-powered devices such as portable electronics, IoT devices, and wearable devices.It is important to note that the specific advantages and application scenarios may vary depending on the overall system requirements and design considerations.