SY10E431JZ TR

SY10E431JZ TR

Manufacturer No:

SY10E431JZ TR

Manufacturer:

Microchip Technology

Description:

IC FF D-TYPE TRPL 1BIT 28PLCC

Datasheet:

Datasheet

Delivery:

Payment:

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SY10E431JZ TR Specifications

  • Type
    Parameter
  • Package / Case
    28-LCC (J-Lead)
  • Supplier Device Package
    28-PLCC (11.48x11.48)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Current - Quiescent (Iq)
    132 mA
  • Voltage - Supply
    -4.2V ~ -5.5V
  • Current - Output High, Low
    -
  • Trigger Type
    Positive Edge
  • Max Propagation Delay @ V, Max CL
    -
  • Clock Frequency
    1.4 GHz
  • Number of Bits per Element
    1
  • Number of Elements
    3
  • Output Type
    Differential
  • Type
    D-Type
  • Function
    Set(Preset) and Reset
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    10E
The SY10E431JZ TR is a specific integrated circuit chip, and without detailed information about its specifications and features, it is challenging to provide specific advantages and application scenarios. However, in general, integrated circuit chips offer several advantages, such as:1. Miniaturization: Integrated circuit chips are compact and can contain a large number of electronic components on a single chip, leading to space-saving designs.2. Power Efficiency: Integrated circuits are designed to operate with low power consumption, making them suitable for battery-powered devices and energy-efficient applications.3. Reliability: Integrated circuits are manufactured using advanced processes, resulting in improved reliability and reduced failure rates.4. Speed and Performance: Integrated circuits can operate at high speeds, enabling fast data processing and improved system performance.5. Cost-Effectiveness: Mass production of integrated circuits reduces manufacturing costs, making them cost-effective for various applications.Regarding the application scenarios of the SY10E431JZ TR chip, it would be best to refer to the datasheet or technical documentation provided by the manufacturer. These documents typically outline the chip's specific features, recommended applications, and potential use cases.