Home / Flip Flops / MC10EP52DR2G/
MC10EP52DR2G

MC10EP52DR2G

Manufacturer No:

MC10EP52DR2G

Manufacturer:

onsemi

Description:

IC FF D-TYPE SNGL 1BIT 8SOIC

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

MC10EP52DR2G Specifications

  • Type
    Parameter
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package
    8-SOIC
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Current - Quiescent (Iq)
    45 mA
  • Voltage - Supply
    -3V ~ -5.5V
  • Current - Output High, Low
    -
  • Trigger Type
    Positive, Negative
  • Max Propagation Delay @ V, Max CL
    -
  • Clock Frequency
    3 GHz
  • Number of Bits per Element
    1
  • Number of Elements
    1
  • Output Type
    Complementary
  • Type
    D-Type
  • Function
    Standard
  • Packaging
    Bulk
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    10EP
The MC10EP52DR2G is a type of integrated circuit chip that offers several advantages and can be applied in various scenarios. Some of these advantages and application scenarios include:1. High-Speed Operation: The MC10EP52DR2G is designed to operate at very high speeds, making it suitable for applications that require fast data transmission or processing. It has a maximum propagation delay of 380ps, allowing for efficient and quick signal transmission.2. Low Voltage Differential Signaling (LVDS) Technology: The chip utilizes LVDS technology, which provides advantages such as low power consumption, noise immunity, and high data rates. It is commonly used in high-speed data communication applications, including display interfaces, Ethernet, and serial communication.3. Wide Operating Range: The MC10EP52DR2G has a wide operating voltage range of -3.0 V to -5.5 V, making it adaptable to different power supply configurations. This flexibility allows the chip to work in diverse electrical environments and enables its integration into various systems.4. Differential Signal Generation and Reception: The chip is capable of generating and receiving differential signals, making it suitable for applications that require balanced signal transmission. Differential signaling provides advantages such as noise reduction and improved data integrity, making it suitable for high-speed communication systems.5. Applications in Communication Systems: The MC10EP52DR2G chip can be utilized in communication systems that require high-speed data transmission, such as fiber optic networks, wireless networks, and data centers. It can help ensure reliable and efficient data transfer between devices and components within these systems.6. Integration into Test and Measurement Equipment: The chip can also be used in test and measurement equipment, such as oscilloscopes and logic analyzers, to analyze and capture high-speed signals accurately. Its high-speed operation and LVDS technology enable precise measurement and analysis of data.Overall, the MC10EP52DR2G integrated circuit chip offers advantages in terms of high-speed operation, low voltage differential signaling, and wide operating range. Its application scenarios include communication systems, test and measurement equipment, and any other applications that require reliable, high-speed data transmission or processing.
MC10EP52DR2G Relevant information