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MC10EP52DR2

MC10EP52DR2

Manufacturer No:

MC10EP52DR2

Manufacturer:

onsemi

Description:

IC FF D-TYPE SNGL 1BIT 8SOIC

Datasheet:

Datasheet

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MC10EP52DR2 Specifications

  • Type
    Parameter
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package
    8-SOIC
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Current - Quiescent (Iq)
    45 mA
  • Voltage - Supply
    -3V ~ -5.5V
  • Current - Output High, Low
    -
  • Trigger Type
    Positive, Negative
  • Max Propagation Delay @ V, Max CL
    -
  • Clock Frequency
    3 GHz
  • Number of Bits per Element
    1
  • Number of Elements
    1
  • Output Type
    Complementary
  • Type
    D-Type
  • Function
    Standard
  • Packaging
    Bulk
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    10EP
The MC10EP52DR2 is a dual differential PECL to single ECL translator integrated circuit chip. Here are the advantages and application scenarios of this chip:Advantages: 1. High-speed operation: It operates at very high speeds, making it suitable for applications that require fast data translation. 2. Low propagation delay: It has a low propagation delay, ensuring quick and reliable data transmission. 3. Voltage level translation: It translates signals from PECL (Positive ECL) to ECL (Emitter-Coupled Logic) voltage levels, allowing compatibility between devices that operate at different voltage levels. 4. Differential input and output: Its differential inputs and outputs provide better signal integrity and noise immunity, making it suitable for high-performance applications. 5. Wide operating voltage range: It operates over a wide voltage range, adding flexibility to its application.Application scenarios: 1. Communication systems: It can be used in telecommunication systems, optical networks, or other high-speed data communication applications where signal translation between PECL and ECL is required. 2. Data processing and networking: It can be utilized in high-speed data processing platforms, networking equipment, or data center applications where signal level translation and high-speed operation are essential. 3. Test and measurement equipment: The chip can be employed in test and measurement instruments where the translation of signals from PECL to ECL voltage levels is necessary for accurate signal analysis. 4. Industrial control systems: It can be used in industrial control systems that require high-speed data translation and reliable signal integrity, particularly where compatibility between PECL and ECL devices is needed. 5. High-speed computing: It can be applied in high-speed computing platforms, supercomputers, or advanced data processing systems where fast signal translation is necessary.It is important to note that the specific application scenarios may vary depending on the requirements of a particular project or system design.
MC10EP52DR2 Relevant information