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74ABT16821ADGG,112

74ABT16821ADGG,112

Manufacturer No:

74ABT16821ADGG,112

Manufacturer:

NXP USA Inc.

Description:

IC FF D-TYPE DUAL 10BIT 56TSSOP

Datasheet:

Datasheet

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74ABT16821ADGG,112 Specifications

  • Type
    Parameter
  • Package / Case
    56-TFSOP (0.240", 6.10mm Width)
  • Supplier Device Package
    56-TSSOP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Input Capacitance
    3 pF
  • Current - Quiescent (Iq)
    1 mA
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    32mA, 64mA
  • Trigger Type
    Positive Edge
  • Max Propagation Delay @ V, Max CL
    3.3ns @ 5V, 50pF
  • Clock Frequency
    250 MHz
  • Number of Bits per Element
    10
  • Number of Elements
    2
  • Output Type
    Tri-State, Non-Inverted
  • Type
    D-Type
  • Function
    Standard
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    74ABT
The 74ABT16821ADGG,112 is an integrated circuit chip that belongs to the 74ABT series of devices. Here are some advantages and application scenarios of this chip:Advantages: 1. High-speed operation: The chip is designed to operate at very high speeds, making it ideal for applications that require fast data transfer.2. Low power consumption: It has low power dissipation characteristics, making it suitable for battery-powered devices and applications where power efficiency is required.3. Wide operating voltage range: The chip can operate within a wide voltage range, typically from 4.5V to 5.5V, which allows for flexibility in different voltage systems.4. Schmitt-trigger inputs: It includes Schmitt-trigger inputs that provide hysteresis and improve noise immunity, allowing more reliable signal reception and processing.5. 3-state outputs: The chip features 3-state outputs, where the outputs can be tri-stated, allowing multiple devices to share a common bus.Application scenarios: 1. High-speed data transfer: The 74ABT16821ADGG,112 chip is commonly used in applications that require high-speed data transfer, such as data communication systems, network switches, and routers.2. Memory interfacing: It can be used for interfacing with various memory devices, such as SRAM or DRAM, due to its high-speed operation and 3-state output capability.3. Industrial automation: The chip's low power consumption and wide voltage range make it suitable for use in industrial automation systems, where it can be used for signal buffering, level shifting, and data acquisition.4. Test and measurement equipment: The high-speed operation and noise immunity of the chip make it suitable for use in test and measurement equipment, such as oscilloscopes or data analyzers.5. Embedded systems: The chip can be utilized in various embedded systems applications, where it can handle data transfer between different components, manage signals, or interface with peripherals.It is important to note that the specific application scenarios may vary based on the requirements of the system and the capabilities of the chip.
74ABT16821ADGG,112 Relevant information