74ABT821D,623

74ABT821D,623

Manufacturer No:

74ABT821D,623

Manufacturer:

NXP USA Inc.

Description:

IC FF D-TYPE SNGL 10BIT 24SO

Datasheet:

Datasheet

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74ABT821D,623 Specifications

  • Type
    Parameter
  • Package / Case
    24-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package
    24-SO
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Input Capacitance
    4 pF
  • Current - Quiescent (Iq)
    250 µA
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    32mA, 64mA
  • Trigger Type
    Positive Edge
  • Max Propagation Delay @ V, Max CL
    6.2ns @ 5V, 50pF
  • Clock Frequency
    185 MHz
  • Number of Bits per Element
    10
  • Number of Elements
    1
  • Output Type
    Tri-State, Non-Inverted
  • Type
    D-Type
  • Function
    Standard
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    74ABT
The 74ABT821D and 623 are both integrated circuit chips that offer various advantages and application scenarios. Advantages of the 74ABT821D: 1. High-speed operation: The chip has the ability to operate at high speeds, making it suitable for applications that require fast data processing. 2. Low power consumption: It is designed to consume less power, making it energy-efficient and ideal for battery-powered devices or applications where power consumption is a concern. 3. Noise immunity: The chip is designed to have high noise immunity, which means it can operate reliably even in noisy environments or when there are electrical disturbances. 4. Output drive capability: It offers a high output drive capability, enabling it to drive multiple loads or devices without additional buffering. 5. Wide voltage range: The chip can operate over a wide voltage range, allowing it to be used in a variety of different voltage systems.Application scenarios of the 74ABT821D: 1. Data communication systems: Due to its high-speed operation and noise immunity, the chip can be used in data communication systems, such as Ethernet switches, routers, or high-speed serial interfaces. 2. Memory systems: It can be used in memory systems, including RAM (Random Access Memory) or cache memory, where fast data processing is required. 3. Microprocessors and microcontrollers: The chip can be used in microprocessors or microcontrollers as a part of their data bus interface, helping to achieve high-speed data transfer between the processor and other peripherals. 4. FPGA (Field-Programmable Gate Array) designs: It can be utilized in FPGA designs for implementing various functions like address decoding, bus interfacing, or signal conditioning due to its high-speed operation and low power consumption.Advantages of the 623: 1. Low power consumption: Similar to the 74ABT821D, the 623 chip is designed to consume low power, making it suitable for applications where energy efficiency is crucial. 2. Small package size: It comes in a small package size, which makes it suitable for use in space-constrained designs or compact electronic devices. 3. Wide input voltage range: The chip can handle a wide input voltage range, allowing it to be used in various voltage systems or applications with fluctuating input voltages. 4. High reliability: The chip is designed for high reliability, ensuring its performance and durability over extended periods of operation. 5. General-purpose usage: The 623 chip can be used in a wide range of general-purpose applications, such as logic gates, signal amplification, signal level shifting, or voltage level translation.Application scenarios of the 623: 1. Battery-powered devices: Due to its low power consumption, small package size, and wide input voltage range, the chip can be used in battery-powered devices like portable electronics, wearables, or IoT (Internet of Things) devices. 2. Interface level shifting: It can be used for interfacing between different voltage domains, converting signals from one voltage level to another, making it useful in mixed-voltage system designs. 3. Sensor interfaces: The chip can be used in sensor interfaces to handle signal conditioning, amplification, or level translation between sensors and microcontrollers or other processing units.