MM54HC175E/883

MM54HC175E/883

Manufacturer No:

MM54HC175E/883

Manufacturer:

National Semiconductor

Description:

D FLIP-FLOP

Datasheet:

Datasheet

Delivery:

Payment:

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MM54HC175E/883 Specifications

  • Type
    Parameter
  • Package / Case
    20-CLCC
  • Supplier Device Package
    20-LCCC (8.89x8.89)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Input Capacitance
    5 pF
  • Current - Quiescent (Iq)
    8 µA
  • Voltage - Supply
    2V ~ 6V
  • Current - Output High, Low
    5.2mA, 5.2mA
  • Trigger Type
    Positive Edge
  • Max Propagation Delay @ V, Max CL
    26ns @ 5V, 50pF
  • Clock Frequency
    70 MHz
  • Number of Bits per Element
    4
  • Number of Elements
    1
  • Output Type
    Complementary
  • Type
    D-Type
  • Function
    Master Reset
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    54HC
The MM54HC175E/883 is a specific integrated circuit (IC) chip, but as an AI language model, I don't have access to real-time information about specific products or their latest specifications. However, I can provide you with general information about IC chips.Integrated circuit chips, like the MM54HC175E/883, offer several advantages and can be used in various application scenarios. Some potential advantages of IC chips include:1. Miniaturization: IC chips are compact and can contain a large number of electronic components on a single chip, allowing for space-saving designs.2. Reliability: IC chips are manufactured in controlled environments, ensuring consistent quality and reliability.3. Power efficiency: IC chips are designed to operate with low power consumption, making them suitable for battery-powered devices.4. Cost-effectiveness: Mass production of IC chips reduces manufacturing costs, making them affordable for a wide range of applications.As for the specific application scenarios of the MM54HC175E/883 chip, it would be best to consult the datasheet or technical documentation provided by the manufacturer. The datasheet typically outlines the chip's features, pin configurations, electrical characteristics, and recommended applications.