74ALVCH16823DGGS

74ALVCH16823DGGS

Manufacturer No:

74ALVCH16823DGGS

Manufacturer:

NXP Semiconductors

Description:

IC FF D-TYPE DUAL 9BIT 56TSSOP

Datasheet:

Datasheet

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74ALVCH16823DGGS Specifications

  • Type
    Parameter
  • Package / Case
    56-TFSOP (0.240", 6.10mm Width)
  • Supplier Device Package
    56-TSSOP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Input Capacitance
    5 pF
  • Voltage - Supply
    2.3V ~ 2.7V, 3V ~ 3.6V
  • Current - Output High, Low
    24mA, 24mA
  • Trigger Type
    Positive Edge
  • Max Propagation Delay @ V, Max CL
    3.7ns @ 3.3V, 50pF
  • Clock Frequency
    350 MHz
  • Number of Bits per Element
    9
  • Number of Elements
    2
  • Output Type
    Tri-State
  • Type
    D-Type
  • Function
    Master Reset
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    74ALVCH
The MB90F038SPFR-GS is a specific model of integrated circuit chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the requirements and use cases, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High-performance: The MB90F038SPFR-GS is designed to deliver high-performance computing capabilities, making it suitable for demanding applications. 2. Low power consumption: This chip is designed to be energy-efficient, which can be advantageous in battery-powered devices or applications where power consumption is a concern. 3. Integrated peripherals: The chip comes with various integrated peripherals, such as UART, I2C, SPI, timers, and ADC, which can simplify the design and reduce the need for external components. 4. Robust communication capabilities: The chip supports various communication protocols, including CAN (Controller Area Network), LIN (Local Interconnect Network), and UART, making it suitable for applications requiring reliable communication. 5. Wide operating temperature range: The MB90F038SPFR-GS can operate within a wide temperature range, making it suitable for applications in harsh environments.Application scenarios: 1. Automotive systems: The MB90F038SPFR-GS is commonly used in automotive applications, such as engine control units (ECUs), body control modules (BCMs), and instrument clusters, where high-performance computing, communication, and reliability are crucial. 2. Industrial automation: The chip can be used in industrial automation systems, such as programmable logic controllers (PLCs), where it can provide high-performance computing, communication, and control capabilities. 3. Consumer electronics: The chip can be utilized in various consumer electronic devices, such as home appliances, gaming consoles, or multimedia systems, where its low power consumption and integrated peripherals can be advantageous. 4. Medical devices: The MB90F038SPFR-GS can be used in medical devices, such as patient monitoring systems or diagnostic equipment, where high-performance computing, communication, and reliability are required. 5. Internet of Things (IoT): The chip can be employed in IoT devices, such as smart sensors or gateways, where its low power consumption, communication capabilities, and wide operating temperature range can be beneficial.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and implementation of the chip in a particular system.