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AM25S09/BFA

AM25S09/BFA

Manufacturer No:

AM25S09/BFA

Manufacturer:

Advanced Micro Devices

Description:

AM25S09 - MUX, QUAD 2 LINE INPUT

Datasheet:

Datasheet

Delivery:

Payment:

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AM25S09/BFA Specifications

  • Type
    Parameter
  • Package / Case
    16-CFlatPack
  • Supplier Device Package
    16-CFlatPack
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C
  • Current - Quiescent (Iq)
    120 mA
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    20mA, 1mA
  • Trigger Type
    Positive Edge
  • Max Propagation Delay @ V, Max CL
    17ns @ 5V, 15pF
  • Number of Bits per Element
    4
  • Number of Elements
    1
  • Output Type
    Non-Inverted
  • Type
    D-Type
  • Function
    Reset
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The AM25S09/BFA integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-speed operation: These chips are designed for high-speed data transfer, making them suitable for applications that require fast and efficient data processing. 2. Low power consumption: The chips are designed to operate with low power consumption, making them suitable for battery-powered devices or applications where power efficiency is crucial. 3. Small form factor: The chips are available in small package sizes, making them suitable for space-constrained applications or devices where size is a critical factor. 4. Easy integration: The chips are designed for easy integration into existing systems, making them suitable for applications that require seamless integration with other components or systems. 5. Reliable performance: The chips are designed to provide reliable and consistent performance, ensuring the accuracy and integrity of data transfer.Application scenarios: 1. Networking equipment: The AM25S09/BFA chips can be used in networking equipment such as routers, switches, and network interface cards to enable high-speed data transfer between devices. 2. Data storage systems: These chips can be used in data storage systems like solid-state drives (SSDs) or RAID controllers to facilitate fast and efficient data transfer between storage devices and the host system. 3. High-performance computing: The chips can be used in high-performance computing systems or servers to enable fast data transfer between different components, such as processors, memory modules, or accelerators. 4. Industrial automation: These chips can be used in industrial automation systems to enable fast and reliable communication between different components or devices, enhancing the overall efficiency and productivity of the system. 5. Telecommunications: The chips can be used in telecommunications equipment such as base stations, optical networking devices, or communication switches to enable high-speed data transfer between different network elements. 6. Consumer electronics: The chips can be used in various consumer electronics devices such as gaming consoles, smart TVs, or multimedia players to facilitate fast data transfer between different components or peripherals.Overall, the AM25S09/BFA integrated circuit chips offer high-speed, low power, and reliable data transfer capabilities, making them suitable for a wide range of applications in different industries.
AM25S09/BFA Relevant information