MC1016P

MC1016P

Manufacturer No:

MC1016P

Manufacturer:

Motorola

Description:

D FLIP-FLOP

Datasheet:

Datasheet

Delivery:

Payment:

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MC1016P Specifications

  • Type
    Parameter
  • Package / Case
    14-DIP (0.300", 7.62mm)
  • Supplier Device Package
    14-DIP
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 75°C
  • Current - Quiescent (Iq)
    36 mA
  • Voltage - Supply
    5.2V
  • Current - Output High, Low
    -
  • Trigger Type
    Positive Edge
  • Max Propagation Delay @ V, Max CL
    -
  • Number of Bits per Element
    1
  • Number of Elements
    2
  • Output Type
    Complementary
  • Type
    D-Type
  • Function
    Standard
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    MC1000
The MC1016P is a specific integrated circuit (IC) chip that was manufactured by Motorola. However, there is limited information available about this particular chip, and it seems to be an older model that may not be widely used or supported anymore. As a result, it is challenging to find specific advantages and application scenarios for the MC1016P.In general, IC chips are used in a wide range of electronic devices and systems to perform various functions. Advantages of IC chips can include:1. Miniaturization: IC chips allow for the integration of multiple electronic components onto a single chip, leading to smaller and more compact devices. 2. Efficiency: IC chips can be designed to be highly efficient, consuming less power and generating less heat. 3. Reliability: Integrated circuits are typically more reliable than discrete components as they are less prone to physical damage or loose connections. 4. Cost-effectiveness: Mass production of IC chips can lead to lower manufacturing costs, making them more affordable for various applications.However, without specific information about the MC1016P chip, it is difficult to provide application scenarios. It is recommended to refer to the datasheet or technical documentation of the chip for detailed information on its features, specifications, and potential applications.