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MM74HCT374WMX

MM74HCT374WMX

Manufacturer No:

MM74HCT374WMX

Manufacturer:

Fairchild Semiconductor

Description:

IC FF D-TYPE SNGL 8BIT 20SOIC

Datasheet:

Datasheet

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MM74HCT374WMX Specifications

  • Type
    Parameter
  • Package / Case
    20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package
    20-SOIC
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Input Capacitance
    10 pF
  • Current - Quiescent (Iq)
    8 µA
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    7.2mA, 7.2mA
  • Trigger Type
    Positive Edge
  • Max Propagation Delay @ V, Max CL
    46ns @ 5V, 150pF
  • Clock Frequency
    30 MHz
  • Number of Bits per Element
    8
  • Number of Elements
    1
  • Output Type
    Tri-State, Non-Inverted
  • Type
    D-Type
  • Function
    Standard
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    74HCT
The XS1-A8A-128-FB217-C10 integrated circuit (IC) chip is a member of the XCore XS1-A family of multicore microcontrollers developed by XMOS. Here are some advantages and application scenarios of this particular chip:Advantages: 1. Multicore architecture: The XS1-A8A-128-FB217-C10 chip features eight high-performance 32-bit processor cores, allowing for parallel processing and efficient execution of complex tasks. 2. Deterministic real-time processing: The XCore architecture provides deterministic timing, enabling precise control and synchronization of time-critical applications. 3. Low latency communication: The chip includes a high-speed interconnect network that allows for low-latency communication between the processor cores, facilitating efficient data transfer and synchronization. 4. Flexible I/O capabilities: The XS1-A8A-128-FB217-C10 chip offers a wide range of I/O options, including digital I/O, analog inputs, and various communication interfaces, making it suitable for diverse application requirements. 5. Low power consumption: XMOS chips are known for their low power consumption, making them suitable for battery-powered or energy-efficient applications.Application scenarios: 1. Audio processing: The XS1-A8A-128-FB217-C10 chip's multicore architecture and low-latency communication capabilities make it ideal for audio processing applications, such as audio mixing, effects processing, and audio streaming. 2. Industrial automation: With its deterministic real-time processing and flexible I/O capabilities, the chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and real-time monitoring. 3. Robotics: The XS1-A8A-128-FB217-C10 chip's parallel processing capabilities and low latency communication can be leveraged in robotics applications, enabling precise control, sensor integration, and real-time decision making. 4. Internet of Things (IoT): The chip's low power consumption and versatile I/O options make it suitable for IoT applications, including smart home devices, sensor networks, and edge computing. 5. Automotive electronics: The XS1-A8A-128-FB217-C10 chip's real-time capabilities and high-performance processing can be utilized in automotive electronics, such as advanced driver assistance systems (ADAS), infotainment systems, and engine control units.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and implementation of the system using the XS1-A8A-128-FB217-C10 chip.
MM74HCT374WMX Relevant information