MC10EP51DTG

MC10EP51DTG

Manufacturer No:

MC10EP51DTG

Manufacturer:

onsemi

Description:

IC FF D-TYPE SNGL 1BIT 8TSSOP

Datasheet:

Datasheet

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MC10EP51DTG Specifications

  • Type
    Parameter
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Supplier Device Package
    8-TSSOP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Current - Quiescent (Iq)
    45 mA
  • Voltage - Supply
    -3V ~ -5.5V
  • Current - Output High, Low
    -
  • Trigger Type
    Positive, Negative
  • Max Propagation Delay @ V, Max CL
    -
  • Clock Frequency
    3 GHz
  • Number of Bits per Element
    1
  • Number of Elements
    1
  • Output Type
    Complementary
  • Type
    D-Type
  • Function
    Reset
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    10EP
The MC10EP51DTG is a high-speed, low-power ECL (Emitter-Coupled Logic) integrated circuit chip. It offers several advantages and can be applied in various scenarios. Here are some of the advantages and application scenarios of the MC10EP51DTG:Advantages: 1. High-speed operation: The MC10EP51DTG operates at very high speeds, making it suitable for applications that require fast data processing and transmission. 2. Low power consumption: This chip is designed to consume low power, making it energy-efficient and suitable for battery-powered devices or applications where power efficiency is crucial. 3. Differential inputs and outputs: The chip supports differential signaling, which provides better noise immunity and signal integrity, making it suitable for applications in noisy environments. 4. Wide operating voltage range: The MC10EP51DTG can operate over a wide voltage range, allowing flexibility in different power supply scenarios. 5. Small form factor: The chip is available in a small package, making it suitable for space-constrained applications.Application scenarios: 1. Telecommunications: The high-speed operation and low power consumption of the MC10EP51DTG make it suitable for telecommunications applications such as high-speed data transmission, clock distribution, and signal conditioning. 2. Networking: The chip can be used in networking equipment for high-speed data processing, clock synchronization, and signal distribution. 3. Test and measurement: The MC10EP51DTG can be used in test and measurement equipment that requires high-speed data acquisition, signal generation, and clock synchronization. 4. Data centers: The chip can be used in data center infrastructure for high-speed data processing, clock distribution, and signal conditioning. 5. Industrial automation: The MC10EP51DTG can be applied in industrial automation systems that require high-speed data processing, signal conditioning, and synchronization.It is important to note that the specific application of the MC10EP51DTG may vary depending on the system requirements and design considerations.