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72V3670L6BBG

72V3670L6BBG

Manufacturer No:

72V3670L6BBG

Description:

IC FIFO SYNC 8KX36 4NS 144BGA

Datasheet:

Datasheet

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72V3670L6BBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    144-PBGA (13x13)
  • Package / Case
    144-BGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • FWFT Support
    Yes
  • Retransmit Capability
    Yes
  • Programmable Flags Support
    Yes
  • Expansion Type
    Depth, Width
  • Bus Directional
    Uni-Directional
  • Current - Supply (Max)
    40mA
  • Voltage - Supply
    3.15 V ~ 3.45 V
  • Access Time
    4ns
  • Data Rate
    166MHz
  • Function
    Synchronous
  • Memory Size
    288K (8K x 36)
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    72V
The 72V3670L6BBG is a specific integrated circuit (IC) chip manufactured by Integrated Device Technology (IDT). However, there is limited information available about this specific chip, and it is possible that it may be a proprietary or specialized product. Without detailed specifications or datasheets, it is challenging to provide specific advantages and application scenarios for this chip.In general, IC chips are used in a wide range of electronic devices and systems, providing various functionalities such as processing, memory, communication, and control. Some potential advantages and application scenarios of IC chips could include:Advantages: 1. Compact Size: IC chips are designed to be small and compact, allowing for integration into various electronic devices without occupying much space. 2. Power Efficiency: IC chips are typically designed to be power-efficient, helping to reduce energy consumption and extend battery life in portable devices. 3. High Performance: IC chips can offer high-speed processing capabilities, enabling efficient data handling and execution of complex tasks. 4. Reliability: IC chips are manufactured using advanced technologies, ensuring high reliability and long-term operation. 5. Cost-Effective: Mass production of IC chips helps to reduce manufacturing costs, making them cost-effective for various applications.Application Scenarios: 1. Consumer Electronics: IC chips are extensively used in smartphones, tablets, laptops, gaming consoles, and other consumer electronic devices to provide processing power, memory, and various functionalities. 2. Automotive: IC chips are used in automotive systems for engine control, infotainment, safety features, and communication modules. 3. Industrial Automation: IC chips find applications in industrial automation systems for control, monitoring, and communication purposes. 4. Internet of Things (IoT): IC chips are used in IoT devices for connectivity, data processing, and control functions. 5. Telecommunications: IC chips are utilized in networking equipment, routers, switches, and communication devices for data handling and network management.It is important to note that the specific advantages and application scenarios of the 72V3670L6BBG chip may vary depending on its intended purpose and specifications. For accurate information, it is recommended to refer to the datasheet or technical documentation provided by the manufacturer.
72V3670L6BBG Relevant information