7202LA20TDB
Manufacturer No:
7202LA20TDB
Manufacturer:
Description:
IC FIFO ASYNC 1KX9 20NS 28CDIP
Datasheet:
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In Stock : 0
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7202LA20TDB Specifications
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TypeParameter
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Supplier Device Package28-CDIP
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Package / Case28-CDIP (0.300", 7.62mm)
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Mounting TypeThrough Hole
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Operating Temperature-55°C ~ 125°C
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FWFT SupportNo
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Retransmit CapabilityYes
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Programmable Flags SupportNo
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Expansion TypeDepth, Width
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Bus DirectionalUni-Directional
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Current - Supply (Max)100mA
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Voltage - Supply4.5 V ~ 5.5 V
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Access Time20ns
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Data Rate33.3MHz
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FunctionAsynchronous
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Memory Size9K (1K x 9)
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DigiKey ProgrammableNot Verified
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PackagingTube
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Product StatusObsolete
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Series7200
The 7202LA20TDB integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The 7202LA20TDB chips offer high-speed operation and low power consumption, making them suitable for applications that require efficient processing. 2. Compact Size: These chips are designed to be compact, allowing for space-saving integration into various electronic devices. 3. Versatility: The 7202LA20TDB chips can be used in a wide range of applications due to their flexible design and compatibility with different systems. 4. Reliability: These chips are built with high-quality materials and undergo rigorous testing, ensuring their reliability and durability.Application Scenarios: 1. Communication Systems: The 7202LA20TDB chips can be used in communication systems such as routers, switches, and network equipment to enable high-speed data processing and transmission. 2. Industrial Automation: These chips can be utilized in industrial automation systems for tasks like control and monitoring, enabling efficient and reliable operation. 3. Automotive Electronics: The 7202LA20TDB chips can be integrated into automotive electronics, including advanced driver-assistance systems (ADAS), infotainment systems, and engine control units (ECUs), to enhance performance and functionality. 4. Consumer Electronics: These chips can be used in various consumer electronic devices like smartphones, tablets, and gaming consoles to enable fast and efficient processing, enhancing user experience. 5. Internet of Things (IoT): The 7202LA20TDB chips can be employed in IoT devices and applications, enabling connectivity, data processing, and control in smart homes, wearables, and other IoT-enabled systems.Overall, the 7202LA20TDB integrated circuit chips offer high performance, compact size, versatility, and reliability, making them suitable for a wide range of applications in communication systems, industrial automation, automotive electronics, consumer electronics, and IoT.
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