Home / FIFOs Memory / 7201LA30TDB/
7201LA30TDB

7201LA30TDB

Manufacturer No:

7201LA30TDB

Description:

IC FIFO ASYNC 512X9 30NS 28CDIP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

7201LA30TDB Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-CDIP
  • Package / Case
    28-CDIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -55°C ~ 125°C
  • FWFT Support
    No
  • Retransmit Capability
    Yes
  • Programmable Flags Support
    No
  • Expansion Type
    Depth, Width
  • Bus Directional
    Uni-Directional
  • Current - Supply (Max)
    100mA
  • Voltage - Supply
    4.5 V ~ 5.5 V
  • Access Time
    30ns
  • Data Rate
    25MHz
  • Function
    Asynchronous
  • Memory Size
    4.5K (512 x 9)
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    7200
The 7201LA30TDB integrated circuit chips, also known as the 7201LA series, offer several advantages and find applications in various scenarios. Here are some of the advantages and application scenarios of these chips:Advantages: 1. Low power consumption: The 7201LA30TDB chips have a low power consumption, making them suitable for energy-efficient devices and battery-powered applications. 2. Small form factor: These chips come in small packages, allowing them to be easily integrated into compact electronic devices and systems. 3. High performance: The 7201LA30TDB chips offer high-speed operation and excellent signal processing capabilities, enabling efficient data processing and communication. 4. Low noise and low distortion: These chips are designed to minimize noise and distortion in signal processing, ensuring high-quality output. 5. Wide operating temperature range: The chips can operate in a wide temperature range, making them suitable for both industrial and consumer applications.Application Scenarios: 1. Internet of Things (IoT): The low power consumption and small form factor make the 7201LA30TDB chips suitable for IoT applications, such as smart home devices, wearable technology, and sensor networks. 2. Communication Systems: These chips can be used in communication systems, including wireless modules, routers, and networking equipment, to process signals and enhance data transmission. 3. Audio and Video Processing: The high-performance and low distortion characteristics make these chips suitable for audio and video processing applications, such as audio amplifiers, video decoders, and multimedia systems. 4. Industrial Control Systems: The wide operating temperature range and low noise make the 7201LA30TDB chips suitable for use in industrial control systems, including factory automation, robotics, and machine monitoring. 5. Medical Devices: These chips can be used in medical devices such as patient monitoring systems, medical imaging equipment, and diagnostic tools, benefiting from their high performance and low power consumption.Overall, the 7201LA30TDB integrated circuit chips offer advantages such as low power consumption, small form factor, high performance, low noise, and wide operating temperature range, making them suitable for diverse application scenarios in IoT, communication systems, audio/video processing, industrial control, and medical devices.
7201LA30TDB Relevant information