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7201LA20TDB

7201LA20TDB

Manufacturer No:

7201LA20TDB

Description:

IC FIFO ASYNC 512X9 20NS 28CDIP

Datasheet:

Datasheet

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7201LA20TDB Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-CDIP
  • Package / Case
    28-CDIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -55°C ~ 125°C
  • FWFT Support
    No
  • Retransmit Capability
    Yes
  • Programmable Flags Support
    No
  • Expansion Type
    Depth, Width
  • Bus Directional
    Uni-Directional
  • Current - Supply (Max)
    100mA
  • Voltage - Supply
    4.5 V ~ 5.5 V
  • Access Time
    20ns
  • Data Rate
    33.3MHz
  • Function
    Asynchronous
  • Memory Size
    4.5K (512 x 9)
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    7200
The 7201LA20TDB integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The 7201LA20TDB chips offer high-speed processing capabilities, making them suitable for applications that require fast data processing. 2. Low Power Consumption: These chips are designed to operate with low power consumption, making them ideal for battery-powered devices or energy-efficient applications. 3. Compact Size: The integrated circuit chips are compact in size, allowing for easy integration into various electronic devices and systems. 4. Versatility: The 7201LA20TDB chips can be used in a wide range of applications due to their versatile nature and compatibility with different systems. 5. Reliability: These chips are designed to be highly reliable, ensuring stable and consistent performance over extended periods.Application Scenarios: 1. Consumer Electronics: The 7201LA20TDB chips can be used in various consumer electronic devices such as smartphones, tablets, gaming consoles, and smart home appliances, where high performance and low power consumption are crucial. 2. Internet of Things (IoT): These chips can be utilized in IoT devices and systems, enabling efficient data processing and connectivity for smart homes, industrial automation, healthcare monitoring, and more. 3. Automotive: The chips can be integrated into automotive systems for applications like advanced driver-assistance systems (ADAS), infotainment systems, and vehicle connectivity, where high performance and reliability are essential. 4. Industrial Automation: The 7201LA20TDB chips can be used in industrial automation systems for tasks such as control, monitoring, and data processing, ensuring efficient and reliable operation. 5. Communication Systems: These chips can be employed in communication systems, including routers, switches, and network equipment, to handle high-speed data processing and ensure smooth communication.Overall, the 7201LA20TDB integrated circuit chips offer high performance, low power consumption, and versatility, making them suitable for a wide range of applications in consumer electronics, IoT, automotive, industrial automation, and communication systems.
7201LA20TDB Relevant information