CYF0018V33L-133BGXI

CYF0018V33L-133BGXI

Manufacturer No:

CYF0018V33L-133BGXI

Manufacturer:

Infineon Technologies

Description:

IC FIFO SYNC 512KX36 209FBGA

Datasheet:

Datasheet

Delivery:

Payment:

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CYF0018V33L-133BGXI Specifications

  • Type
    Parameter
  • Supplier Device Package
    209-FBGA (14x22)
  • Package / Case
    209-BGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • FWFT Support
    No
  • Retransmit Capability
    Yes
  • Programmable Flags Support
    Yes
  • Expansion Type
    Width
  • Bus Directional
    Uni-Directional
  • Current - Supply (Max)
    -
  • Voltage - Supply
    3 V ~ 3.6 V
  • Access Time
    10ns
  • Data Rate
    133MHz
  • Function
    Synchronous
  • Memory Size
    18M (512K x 36)
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The CYF0018V33L-133BGXI integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low power consumption: These chips are designed to operate at low power levels, making them suitable for battery-powered devices and energy-efficient applications. 2. Small form factor: The chips are compact in size, allowing for space-saving designs and integration into small devices. 3. High performance: They offer high-speed data processing capabilities, enabling efficient and fast operation. 4. Wide operating voltage range: The chips can operate within a wide voltage range, making them versatile and compatible with various power supply configurations. 5. Robust and reliable: They are designed to withstand harsh environmental conditions and provide reliable performance over extended periods.Application scenarios: 1. Internet of Things (IoT) devices: These chips can be used in IoT devices such as smart home appliances, wearable devices, and industrial sensors, where low power consumption and small form factor are crucial. 2. Consumer electronics: They can be utilized in smartphones, tablets, and other portable devices, where high performance and low power consumption are essential. 3. Automotive electronics: The chips can be employed in automotive applications like infotainment systems, advanced driver-assistance systems (ADAS), and engine control units (ECUs), where reliability and high performance are required. 4. Industrial automation: They can be used in industrial control systems, robotics, and factory automation equipment, where robustness, reliability, and high-speed data processing are necessary. 5. Medical devices: These chips can be applied in medical devices such as patient monitoring systems, diagnostic equipment, and implantable devices, where low power consumption and small form factor are critical.Overall, the CYF0018V33L-133BGXI integrated circuit chips offer a combination of low power consumption, small form factor, high performance, and reliability, making them suitable for a wide range of applications in various industries.