72V3670L6BB
Manufacturer No:
72V3670L6BB
Manufacturer:
Description:
IC FIFO SYNC 8KX36 4NS 144BGA
Datasheet:
Delivery:
Payment:
In Stock : 0
Please send RFQ , we will respond immediately.
72V3670L6BB Specifications
-
TypeParameter
-
Supplier Device Package144-PBGA (13x13)
-
Package / Case144-BGA
-
Mounting TypeSurface Mount
-
Operating Temperature0°C ~ 70°C
-
FWFT SupportYes
-
Retransmit CapabilityYes
-
Programmable Flags SupportYes
-
Expansion TypeDepth, Width
-
Bus DirectionalUni-Directional
-
Current - Supply (Max)40mA
-
Voltage - Supply3.15 V ~ 3.45 V
-
Access Time4ns
-
Data Rate166MHz
-
FunctionSynchronous
-
Memory Size288K (8K x 36)
-
DigiKey ProgrammableNot Verified
-
PackagingTray
-
Product StatusObsolete
-
Series72V
The 72V3670L6BB is a specific integrated circuit (IC) chip, and without detailed information about its specifications and features, it is challenging to provide specific advantages and application scenarios. However, here are some general advantages and potential application scenarios for IC chips:Advantages of IC chips: 1. Miniaturization: IC chips allow for the integration of multiple electronic components onto a single chip, leading to smaller and more compact devices. 2. Power efficiency: IC chips are designed to be power-efficient, reducing energy consumption and extending battery life in portable devices. 3. Reliability: IC chips are manufactured using advanced processes, ensuring high reliability and long-term performance. 4. Cost-effectiveness: Mass production of IC chips reduces manufacturing costs, making them more affordable for various applications. 5. Performance: IC chips can provide high-speed processing, improved signal quality, and advanced functionality compared to discrete components.Application scenarios for IC chips: 1. Consumer Electronics: IC chips are extensively used in smartphones, tablets, laptops, televisions, gaming consoles, and other consumer electronic devices. 2. Automotive: IC chips are crucial in automotive applications, including engine control units, infotainment systems, advanced driver-assistance systems (ADAS), and electric vehicle components. 3. Industrial Automation: IC chips are used in industrial control systems, robotics, motor drives, sensors, and other automation applications. 4. Communication Systems: IC chips are employed in networking equipment, routers, switches, modems, and wireless communication devices. 5. Medical Devices: IC chips are utilized in medical imaging equipment, patient monitoring systems, implantable devices, and diagnostic instruments. 6. Aerospace and Defense: IC chips are essential in avionics, satellite systems, radar systems, communication systems, and military equipment.It is important to note that the specific advantages and application scenarios of the 72V3670L6BB IC chip may vary based on its unique features and specifications.
72V3670L6BB Relevant information
-
72V3613L12PFG
Renesas Electronics America Inc -
723641L20PFGI
Renesas Electronics America Inc -
72131L35P
Renesas Electronics America Inc -
72V3642L15PFGI8
Renesas Electronics America Inc -
72V3642L15PFGI
Renesas Electronics America Inc -
723641L20PFGI8
Renesas Electronics America Inc -
CD40105BKMSR
Renesas Electronics America Inc -
CD40105BHSR
Renesas Electronics America Inc -
CD40105BDMSR
Renesas Electronics America Inc -
CD40105BF3A
Texas Instruments