72V255LA10PF8

72V255LA10PF8

Manufacturer No:

72V255LA10PF8

Description:

IC FIFO SYNC 8KX18 6.5NS 64TQFP

Datasheet:

Datasheet

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72V255LA10PF8 Specifications

  • Type
    Parameter
  • Supplier Device Package
    64-TQFP (14x14)
  • Package / Case
    64-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • FWFT Support
    Yes
  • Retransmit Capability
    Yes
  • Programmable Flags Support
    Yes
  • Expansion Type
    Depth, Width
  • Bus Directional
    Uni-Directional
  • Current - Supply (Max)
    55mA
  • Voltage - Supply
    3 V ~ 3.6 V
  • Access Time
    6.5ns
  • Data Rate
    100MHz
  • Function
    Synchronous
  • Memory Size
    144K (8K x 18)
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    72V
The 72V255LA10PF8 is an integrated circuit (IC) chip designed by a specific manufacturer. As an AI language model, I don't have access to real-time information about specific products or their specifications. However, I can provide you with general information about IC chips.Integrated circuit chips are used in a wide range of electronic devices and systems. They offer several advantages, such as:1. Miniaturization: IC chips allow for the integration of multiple electronic components onto a single chip, reducing the size and weight of electronic devices.2. Power efficiency: IC chips are designed to be power-efficient, helping to extend the battery life of portable devices.3. Cost-effectiveness: Mass production of IC chips reduces manufacturing costs, making them more affordable for various applications.4. Reliability: IC chips are designed to be reliable and have a longer lifespan compared to discrete electronic components.Regarding the specific application scenarios of the 72V255LA10PF8 chip, it would be best to consult the manufacturer's documentation, datasheets, or application notes. These resources typically provide detailed information about the chip's features, specifications, and recommended applications.