IDT72T51248L6-7BBI

IDT72T51248L6-7BBI

Manufacturer No:

IDT72T51248L6-7BBI

Description:

IC FIFO SYNC 8KX40X4 324PBGA

Datasheet:

Datasheet

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IDT72T51248L6-7BBI Specifications

  • Type
    Parameter
  • Supplier Device Package
    324-PBGA (19x19)
  • Package / Case
    324-BGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • FWFT Support
    Yes
  • Retransmit Capability
    No
  • Programmable Flags Support
    Yes
  • Expansion Type
    -
  • Bus Directional
    Uni-Directional
  • Current - Supply (Max)
    260mA
  • Voltage - Supply
    2.375 V ~ 2.625 V
  • Access Time
    3.8ns
  • Data Rate
    150MHz
  • Function
    Synchronous
  • Memory Size
    1.25M (8K x 40 x 4)
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    72T
The IDT72T51248L6-7BBI is a specific model of a high-speed integrated circuit chip manufactured by Integrated Device Technology (IDT). Although the detailed advantages and application scenarios of this chip might require more specific information, here are some general advantages and potential applications of high-speed integrated circuit chips:Advantages of high-speed integrated circuit chips: 1. Fast data processing: High-speed integrated circuit chips typically have advanced architectures and optimized designs to handle data at high speeds, enabling faster processing and response times. 2. Enhanced performance: These chips often offer improved performance in terms of throughput, bandwidth, and latency, making them suitable for applications that require quick and efficient data processing. 3. Reduced power consumption: Many high-speed integrated circuit chips are designed with power-saving features and techniques to minimize power consumption while maintaining high performance. 4. Integration and miniaturization: These chips usually pack multiple functionalities and components into a single integrated circuit, leading to smaller footprints and simplified system designs.Application scenarios of high-speed integrated circuit chips: 1. Networking and telecommunications: High-speed integrated circuit chips are commonly used in routers, switches, network interface cards, and other networking devices to handle the high data rates and ensure efficient data transfer. 2. Data centers and servers: These chips are utilized in data centers and servers to process and manage significant volumes of data and efficiently handle multiple concurrent tasks. 3. Storage systems: High-speed integrated circuit chips are employed in solid-state drives (SSDs) and storage controllers to enable fast data access, high-throughput operations, and reliable data storage. 4. High-performance computing: These chips find applications in supercomputers, scientific simulations, artificial intelligence, machine learning, and other computation-intensive tasks that require rapid data processing. 5. Consumer electronics: High-speed integrated circuit chips are employed in various consumer electronic devices such as smartphones, tablets, gaming consoles, and smart TVs to support fast data transmission, multimedia processing, and other high-performance functionalities.It is important to note that the IDT72T51248L6-7BBI chip is a specific model, and precise information about its advantages and application scenarios might require accessing the chip's datasheet and technical documentation provided by IDT.