72T3665L6-7BB
Manufacturer No:
72T3665L6-7BB
Manufacturer:
Description:
IC FIFO ASYNC/SYN 4KX36 208PBGA
Datasheet:
Delivery:
Payment:
In Stock : 0
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72T3665L6-7BB Specifications
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TypeParameter
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Supplier Device Package208-PBGA (17x17)
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Package / Case208-BGA
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Mounting TypeSurface Mount
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Operating Temperature0°C ~ 70°C
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FWFT SupportYes
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Retransmit CapabilityYes
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Programmable Flags SupportYes
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Expansion TypeDepth, Width
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Bus DirectionalUni-Directional
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Current - Supply (Max)70mA
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Voltage - Supply2.375 V ~ 2.625 V
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Access Time12ns, 3.8ns
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Data Rate66MHz, 150MHz
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FunctionAsynchronous, Synchronous
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Memory Size144K (4K x 36)
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusObsolete
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Series72T
The specific integrated circuit chip mentioned, 72T3665L6-7BB, is not a commonly known or standard chip. Therefore, it is challenging to provide specific advantages and application scenarios for this chip without more information. It is possible that it may be a custom or specialized chip designed for a specific application or purpose. In general, the advantages of integrated circuit chips include: 1. Compact size: Integrated circuit chips pack a large number of electronic components and functions into a small silicon chip, reducing the physical size of electronic devices. 2. Low power consumption: These chips are designed to be energy-efficient, making them suitable for battery-powered devices or devices requiring low power usage. 3. Cost-effective: Mass production techniques lead to lower production costs for integrated circuit chips, making them affordable for various applications. 4. High reliability: Integrated circuits are designed and manufactured with high accuracy and quality control, ensuring their reliability and long lifespan. 5. Versatility: These chips can be designed to perform a wide range of functions, making them applicable in various devices and systems.However, without more information about the 72T3665L6-7BB chip, it is not possible to provide specific applications or scenarios where this chip can be utilized.
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