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72T3655L5BBI

72T3655L5BBI

Manufacturer No:

72T3655L5BBI

Description:

IC FIFO ASYNC/SYN 2KX36 208PBGA

Datasheet:

Datasheet

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72T3655L5BBI Specifications

  • Type
    Parameter
  • Supplier Device Package
    208-PBGA (17x17)
  • Package / Case
    208-BGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • FWFT Support
    Yes
  • Retransmit Capability
    Yes
  • Programmable Flags Support
    Yes
  • Expansion Type
    Depth, Width
  • Bus Directional
    Uni-Directional
  • Current - Supply (Max)
    70mA
  • Voltage - Supply
    2.375 V ~ 2.625 V
  • Access Time
    10ns, 3.6ns
  • Data Rate
    83MHz, 200MHz
  • Function
    Asynchronous, Synchronous
  • Memory Size
    72K (2K x 36)
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    72T
The 72T3655L5BBI integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are designed to provide high-performance computing capabilities, making them suitable for demanding applications. 2. Low Power Consumption: They are optimized for low power consumption, making them ideal for battery-powered devices or energy-efficient applications. 3. Compact Size: The chips are designed to be compact, allowing for easy integration into small form factor devices. 4. High Reliability: They offer high reliability and stability, ensuring consistent performance over extended periods. 5. Versatility: These chips can be used in a wide range of applications, thanks to their flexible architecture and compatibility with various systems.Application Scenarios: 1. Embedded Systems: The 72T3655L5BBI chips can be used in embedded systems, such as industrial automation, robotics, or IoT devices, where high-performance computing is required in a compact form factor. 2. Consumer Electronics: These chips can be utilized in consumer electronics devices like smartphones, tablets, or wearable devices, where low power consumption and high performance are crucial. 3. Automotive: The chips can be employed in automotive applications, such as advanced driver-assistance systems (ADAS), infotainment systems, or engine control units (ECUs), where reliability, performance, and compact size are essential. 4. Medical Devices: They can be used in medical devices like portable diagnostic equipment, patient monitoring systems, or implantable devices, where low power consumption, high reliability, and compact size are critical. 5. Communication Systems: The chips can be utilized in communication systems, including routers, switches, or network appliances, where high-performance computing and low power consumption are required.It is important to note that the specific advantages and application scenarios may vary depending on the exact specifications and features of the 72T3655L5BBI integrated circuit chips.
72T3655L5BBI Relevant information