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72T3655L4-4BB

72T3655L4-4BB

Manufacturer No:

72T3655L4-4BB

Description:

IC FIFO ASYNC/SYN 2KX36 208PBGA

Datasheet:

Datasheet

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72T3655L4-4BB Specifications

  • Type
    Parameter
  • Supplier Device Package
    208-PBGA (17x17)
  • Package / Case
    208-BGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • FWFT Support
    Yes
  • Retransmit Capability
    Yes
  • Programmable Flags Support
    Yes
  • Expansion Type
    Depth, Width
  • Bus Directional
    Uni-Directional
  • Current - Supply (Max)
    70mA
  • Voltage - Supply
    2.375 V ~ 2.625 V
  • Access Time
    8ns, 3.4ns
  • Data Rate
    100MHz, 225MHz
  • Function
    Asynchronous, Synchronous
  • Memory Size
    72K (2K x 36)
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    72T
The 72T3655L4-4BB integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are designed to provide high-performance computing capabilities, making them suitable for demanding applications. 2. Low Power Consumption: They are optimized for low power consumption, making them ideal for battery-powered devices or energy-efficient applications. 3. Compact Size: The chips are designed to be compact, allowing for easy integration into small form factor devices. 4. Versatility: They can be used in a wide range of applications, thanks to their versatile design and capabilities. 5. Reliability: These chips are built to be reliable and durable, ensuring long-term operation without frequent failures.Application Scenarios: 1. Internet of Things (IoT): The chips can be used in IoT devices, such as smart home appliances, wearables, or industrial sensors, where low power consumption and compact size are crucial. 2. Embedded Systems: They are suitable for embedded systems, including automotive electronics, medical devices, or industrial control systems, where high performance and reliability are required. 3. Consumer Electronics: These chips can be used in various consumer electronics, such as smartphones, tablets, or gaming consoles, where a balance between performance and power efficiency is essential. 4. Communication Systems: They can be utilized in communication systems, including routers, switches, or network equipment, where high-speed data processing and low power consumption are critical. 5. Data Centers: The chips can be employed in data centers for high-performance computing, cloud computing, or artificial intelligence applications, where efficient power consumption and compact size are important.Overall, the 72T3655L4-4BB integrated circuit chips offer high performance, low power consumption, and compact size, making them suitable for a wide range of applications in various industries.
72T3655L4-4BB Relevant information