SN74ABT3613-30PQ

SN74ABT3613-30PQ

Manufacturer No:

SN74ABT3613-30PQ

Manufacturer:

Texas Instruments

Description:

IC 64X36 SYNC FIFO MEM 132-QFP

Datasheet:

Datasheet

Delivery:

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SN74ABT3613-30PQ Specifications

  • Type
    Parameter
  • Supplier Device Package
    132-BQFP (24.13x24.13)
  • Package / Case
    132-BQFP Bumpered
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • FWFT Support
    No
  • Retransmit Capability
    No
  • Programmable Flags Support
    Yes
  • Expansion Type
    -
  • Bus Directional
    Bi-Directional
  • Current - Supply (Max)
    130mA
  • Voltage - Supply
    4.5 V ~ 5.5 V
  • Access Time
    15ns
  • Data Rate
    33.4MHz
  • Function
    Synchronous
  • Memory Size
    2.25K (64 x 36)
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    74ABT
The SN74ABT3613-30PQ is a specific integrated circuit chip manufactured by Texas Instruments. It is a 16-bit registered transceiver with 3-state outputs. Here are some advantages and application scenarios of this chip:Advantages: 1. High-speed operation: The SN74ABT3613-30PQ operates at a high-speed of 10 ns propagation delay, making it suitable for applications that require fast data transfer. 2. 3-state outputs: The chip has 3-state outputs, which means it can be disabled or put into a high-impedance state, allowing multiple devices to share a common bus without interfering with each other. 3. Wide operating voltage range: It can operate within a wide voltage range of 4.5V to 5.5V, making it compatible with various power supply systems. 4. ESD protection: The chip provides Electrostatic Discharge (ESD) protection, safeguarding it against damage from static electricity.Application scenarios: 1. Data communication: The SN74ABT3613-30PQ can be used in applications that require bidirectional data transfer, such as communication interfaces between microcontrollers, memory modules, or peripheral devices. 2. Bus systems: It is suitable for use in bus systems where multiple devices need to share a common data bus, such as in computer systems, industrial automation, or automotive electronics. 3. Level shifting: The chip can be used for level shifting between different voltage domains, allowing communication between devices operating at different voltage levels. 4. Buffering: It can be used as a buffer to isolate and amplify signals, ensuring proper signal integrity and preventing signal degradation in high-speed data transmission.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and design considerations of a particular project. It is recommended to refer to the datasheet and consult with technical experts for a comprehensive understanding of the chip's capabilities and suitability for a specific application.