72T72115L5BBI
Manufacturer No:
72T72115L5BBI
Manufacturer:
Description:
IC FIFO ASYNC/SYN 128KX72 324BGA
Datasheet:
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72T72115L5BBI Specifications
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TypeParameter
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Supplier Device Package324-PBGA (19x19)
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Package / Case324-BGA
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C
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FWFT SupportYes
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Retransmit CapabilityYes
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Programmable Flags SupportYes
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Expansion TypeDepth, Width
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Bus DirectionalUni-Directional
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Current - Supply (Max)130mA
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Voltage - Supply2.375 V ~ 2.625 V
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Access Time10ns, 3.6ns
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Data Rate83MHz, 200MHz
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FunctionAsynchronous, Synchronous
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Memory Size9M (128K x 72)
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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Series72T
The 72T72115L5BBI integrated circuit chip, also known as the 72T72115BBI, is a System-on-Chip (SoC) solution primarily designed for Ethernet switch applications. Here are some advantages and application scenarios associated with this chip:Advantages: 1. High Performance: The 72T72115L5BBI chip offers high performance and advanced features, making it suitable for demanding network applications. 2. Integration: It integrates various components like switch fabric, packet memory, CPU, and other essential functions into a single chip, reducing the need for external components and simplifying the overall design. 3. Power Efficiency: The chip is designed to optimize power efficiency, enabling energy-saving operation for network switches. 4. Scalability: It offers scalability options, allowing for the creation of switches with differing port configurations and sizes. 5. Built-in Security: The chip includes security features such as ACL (Access Control List), MACsec (Media Access Control Security), and other protocols to enhance data protection.Application Scenarios: 1. Enterprise Network Switches: The 72T72115L5BBI chip can be used in Ethernet switches for enterprise networks, providing high-performance and secure communication among various network devices. 2. Data Centers: It is suitable for use in data center switches, where scalability, power efficiency, and reliable performance are crucial for handling high volumes of data traffic. 3. Service Provider Networks: The chip can be deployed in service provider switches that offer advanced network services and high-speed connectivity to customers. 4. Industrial Networks: It can also be utilized in industrial switches, providing robust and stable communication within industrial automation systems, smart cities, and other industrial settings. 5. Campus Networks: The chip's features make it suitable for campus network switches, enabling efficient and secure network operation in educational institutions, government facilities, and corporate campuses.It is important to note that the specific advantages and practical applications may vary depending on the exact requirements and implementation of the network switch design.
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