72T72115L5BBI

72T72115L5BBI

Manufacturer No:

72T72115L5BBI

Description:

IC FIFO ASYNC/SYN 128KX72 324BGA

Datasheet:

Datasheet

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72T72115L5BBI Specifications

  • Type
    Parameter
  • Supplier Device Package
    324-PBGA (19x19)
  • Package / Case
    324-BGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • FWFT Support
    Yes
  • Retransmit Capability
    Yes
  • Programmable Flags Support
    Yes
  • Expansion Type
    Depth, Width
  • Bus Directional
    Uni-Directional
  • Current - Supply (Max)
    130mA
  • Voltage - Supply
    2.375 V ~ 2.625 V
  • Access Time
    10ns, 3.6ns
  • Data Rate
    83MHz, 200MHz
  • Function
    Asynchronous, Synchronous
  • Memory Size
    9M (128K x 72)
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    72T
The 72T72115L5BBI integrated circuit chip, also known as the 72T72115BBI, is a System-on-Chip (SoC) solution primarily designed for Ethernet switch applications. Here are some advantages and application scenarios associated with this chip:Advantages: 1. High Performance: The 72T72115L5BBI chip offers high performance and advanced features, making it suitable for demanding network applications. 2. Integration: It integrates various components like switch fabric, packet memory, CPU, and other essential functions into a single chip, reducing the need for external components and simplifying the overall design. 3. Power Efficiency: The chip is designed to optimize power efficiency, enabling energy-saving operation for network switches. 4. Scalability: It offers scalability options, allowing for the creation of switches with differing port configurations and sizes. 5. Built-in Security: The chip includes security features such as ACL (Access Control List), MACsec (Media Access Control Security), and other protocols to enhance data protection.Application Scenarios: 1. Enterprise Network Switches: The 72T72115L5BBI chip can be used in Ethernet switches for enterprise networks, providing high-performance and secure communication among various network devices. 2. Data Centers: It is suitable for use in data center switches, where scalability, power efficiency, and reliable performance are crucial for handling high volumes of data traffic. 3. Service Provider Networks: The chip can be deployed in service provider switches that offer advanced network services and high-speed connectivity to customers. 4. Industrial Networks: It can also be utilized in industrial switches, providing robust and stable communication within industrial automation systems, smart cities, and other industrial settings. 5. Campus Networks: The chip's features make it suitable for campus network switches, enabling efficient and secure network operation in educational institutions, government facilities, and corporate campuses.It is important to note that the specific advantages and practical applications may vary depending on the exact requirements and implementation of the network switch design.