72T18125L10BB

72T18125L10BB

Manufacturer No:

72T18125L10BB

Description:

IC FIFO ASYNC/SYNC 1MX9 240BGA

Datasheet:

Datasheet

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72T18125L10BB Specifications

  • Type
    Parameter
  • Supplier Device Package
    240-PBGA (19x19)
  • Package / Case
    240-BGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • FWFT Support
    Yes
  • Retransmit Capability
    Yes
  • Programmable Flags Support
    Yes
  • Expansion Type
    Depth, Width
  • Bus Directional
    Uni-Directional
  • Current - Supply (Max)
    70mA
  • Voltage - Supply
    2.375 V ~ 2.625 V
  • Access Time
    14ns, 4.5ns
  • Data Rate
    50MHz, 100MHz
  • Function
    Asynchronous, Synchronous
  • Memory Size
    9M (512K x 18)(1M x 9)
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    72T
The 72T18125L10BB is a specific integrated circuit (IC) chip manufactured by Texas Instruments. It is a 18-bit registered transceiver with 3-state outputs, designed for high-performance bus-oriented systems. Here are some advantages and application scenarios of this IC chip:Advantages: 1. High-speed operation: The 72T18125L10BB chip operates at a high-speed rate, making it suitable for applications that require fast data transfer and processing. 2. 3-state outputs: The chip has 3-state outputs, which means it can drive the bus lines to a high-impedance state when not actively transmitting data. This feature allows multiple devices to share the same bus without interfering with each other. 3. Registered transceiver: The chip has built-in registers that can store data before transmitting or after receiving, providing synchronization and buffering capabilities. 4. Wide operating voltage range: The chip can operate within a wide voltage range, making it compatible with various power supply systems.Application scenarios: 1. Data communication systems: The 72T18125L10BB chip can be used in applications such as networking equipment, routers, switches, and data storage systems, where high-speed data transmission and reliable bus communication are crucial. 2. Industrial automation: In industrial automation systems, this chip can be used for controlling and monitoring devices on a bus, such as sensors, actuators, and motor controllers. 3. Embedded systems: The chip can be integrated into embedded systems, such as microcontrollers or microprocessors, to facilitate communication between different components or subsystems. 4. Test and measurement equipment: The high-speed operation and 3-state outputs of the chip make it suitable for use in test and measurement equipment, where accurate and fast data acquisition and analysis are required.It is important to note that the specific application scenarios may vary depending on the requirements of the system and the overall design considerations.