72V2103L6BC
Manufacturer No:
72V2103L6BC
Manufacturer:
Description:
IC FIFO SYNC 256KX9 100CABGA
Datasheet:
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72V2103L6BC Specifications
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TypeParameter
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Supplier Device Package100-CABGA (11x11)
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Package / Case100-LBGA
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Mounting TypeSurface Mount
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Operating Temperature0°C ~ 70°C
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FWFT SupportYes
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Retransmit CapabilityYes
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Programmable Flags SupportYes
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Expansion TypeDepth, Width
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Bus DirectionalUni-Directional
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Current - Supply (Max)35mA
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Voltage - Supply3.15 V ~ 3.45 V
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Access Time4ns
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Data Rate166MHz
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FunctionSynchronous
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Memory Size2.25M (128K x 18)(256K x 9)
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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Series72V
The 72V2103L6BC is a specific integrated circuit (IC) chip manufactured by Texas Instruments. It is a 3.3V, 64K x 9 Asynchronous FIFO memory chip. Here are some advantages and application scenarios of this IC chip:Advantages: 1. High-speed operation: The 72V2103L6BC chip operates at high speeds, making it suitable for applications that require fast data transfer and processing. 2. Large memory capacity: With a memory capacity of 64K x 9, this chip can store a significant amount of data, making it suitable for applications that require large data buffers. 3. Asynchronous operation: The chip supports asynchronous data transfer, allowing it to interface with different devices and systems without strict timing requirements. 4. Low power consumption: The 72V2103L6BC chip is designed to consume low power, making it suitable for battery-powered or energy-efficient applications. 5. Easy integration: The chip is available in a compact package and can be easily integrated into various electronic systems.Application scenarios: 1. Data communication systems: The 72V2103L6BC chip can be used in data communication systems, such as routers, switches, and network interface cards, to buffer and transfer data between different components. 2. Industrial automation: In industrial automation applications, this chip can be used for data buffering and synchronization between different control units, sensors, and actuators. 3. Telecommunications: The chip can be used in telecommunications equipment, such as base stations or network switches, to handle data buffering and transfer between different communication channels. 4. Test and measurement equipment: The 72V2103L6BC chip can be used in test and measurement equipment to store and process data during testing or data acquisition processes. 5. Embedded systems: This chip can be used in various embedded systems, such as automotive electronics, medical devices, or consumer electronics, where data buffering and transfer are required.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design considerations of the overall system in which the chip is used.
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