72V3642L10PFG8
Manufacturer No:
72V3642L10PFG8
Manufacturer:
Description:
IC FIFO SYNC 1KX36X2 120TQFP
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72V3642L10PFG8 Specifications
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TypeParameter
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Supplier Device Package120-TQFP (14x14)
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Package / Case120-LQFP
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Mounting TypeSurface Mount
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Operating Temperature0°C ~ 70°C
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FWFT SupportYes
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Retransmit CapabilityNo
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Programmable Flags SupportYes
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Expansion TypeWidth
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Bus DirectionalBi-Directional
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Current - Supply (Max)400mA
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Voltage - Supply3 V ~ 3.6 V
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Access Time6.5ns
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Data Rate100MHz
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FunctionSynchronous
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Memory Size72k (1k x 36 x 2)
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DigiKey ProgrammableNot Verified
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PackagingTape & Reel (TR)
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Product StatusLast Time Buy
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Series72V
The 72V3642L10PFG8 is a specific integrated circuit (IC) chip manufactured by Texas Instruments. It is a 36K x 42-bit synchronous high-speed static RAM (SRAM) with a 72V voltage rating. Here are some advantages and application scenarios of this IC chip:Advantages: 1. High-speed operation: The 72V3642L10PFG8 offers fast access times and high-speed operation, making it suitable for applications that require quick data retrieval and processing. 2. Large memory capacity: With a capacity of 36K x 42 bits, this IC chip provides a significant amount of memory storage, allowing for the handling of large amounts of data. 3. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial. 4. Wide voltage range: The 72V voltage rating allows the chip to operate in high-voltage environments, making it suitable for industrial or automotive applications that require robustness and reliability.Application scenarios: 1. Industrial automation: The high-speed and large memory capacity of the 72V3642L10PFG8 make it suitable for use in industrial automation systems, such as programmable logic controllers (PLCs) or robotics, where quick data processing and storage are essential. 2. Automotive electronics: The wide voltage range and low power consumption of the chip make it suitable for automotive applications, such as engine control units (ECUs), where high-voltage operation and power efficiency are required. 3. Power grid monitoring: The chip's high-speed operation and large memory capacity can be utilized in power grid monitoring systems, allowing for real-time data acquisition and analysis. 4. Medical devices: The chip's robustness, low power consumption, and large memory capacity make it suitable for medical devices, such as patient monitoring systems or medical imaging equipment, where reliability and data storage are critical.It's important to note that the specific application scenarios may vary depending on the requirements and specifications of the system being designed.
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