SN74ACT7200L35DV

SN74ACT7200L35DV

Manufacturer No:

SN74ACT7200L35DV

Manufacturer:

Texas Instruments

Description:

IC FIFO ASYNC 1KX9 35NS 28SOIC

Datasheet:

Datasheet

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SN74ACT7200L35DV Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-SOIC
  • Package / Case
    28-SOIC
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • FWFT Support
    No
  • Retransmit Capability
    Yes
  • Programmable Flags Support
    No
  • Expansion Type
    Depth, Width
  • Bus Directional
    Uni-Directional
  • Current - Supply (Max)
    80mA
  • Voltage - Supply
    4.5 V ~ 5.5 V
  • Access Time
    35ns
  • Data Rate
    22.22MHz
  • Function
    Asynchronous
  • Memory Size
    9K (1K x 9)
  • DigiKey Programmable
    Not Verified
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The SN74ACT7200L35DV is a specific model of integrated circuit chip manufactured by Texas Instruments. It is a 32-bit universal bus transceiver with 3-state outputs. Here are some advantages and application scenarios of this chip:Advantages: 1. High-speed operation: The SN74ACT7200L35DV operates at a high speed, making it suitable for applications that require fast data transfer. 2. 3-state outputs: The chip has 3-state outputs, which means it can be easily connected to a bus system without causing any conflicts or contention. 3. Wide operating voltage range: It can operate within a wide voltage range, typically between 4.5V and 5.5V, making it compatible with various power supply systems. 4. Low power consumption: The chip is designed to consume low power, making it suitable for battery-powered devices or applications where power efficiency is crucial.Application scenarios: 1. Data communication systems: The SN74ACT7200L35DV can be used in various data communication systems, such as UART (Universal Asynchronous Receiver-Transmitter) interfaces, where it can facilitate the transfer of data between different devices. 2. Microprocessor interfacing: It can be used to interface microprocessors or microcontrollers with other peripheral devices, such as memory modules or input/output devices. 3. Bus systems: The chip's 3-state outputs make it suitable for use in bus systems, where multiple devices share a common data bus. It can enable bidirectional data transfer and prevent conflicts on the bus. 4. Industrial automation: The chip can be used in industrial automation systems, where it can facilitate the exchange of data between different components or subsystems. 5. Embedded systems: It can be used in various embedded systems, such as automotive electronics, consumer electronics, or medical devices, where it can help in data transfer and interfacing tasks.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design considerations of a particular project.