SN74ACT7201LA35DV
Manufacturer No:
SN74ACT7201LA35DV
Manufacturer:
Description:
IC FIFO ASYNC 512X9 35NS 28SOIC
Datasheet:
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In Stock : 990
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SN74ACT7201LA35DV Specifications
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TypeParameter
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Supplier Device Package28-SOIC
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Package / Case28-SOIC
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Mounting TypeSurface Mount
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Operating Temperature0°C ~ 70°C
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FWFT SupportNo
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Retransmit CapabilityYes
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Programmable Flags SupportNo
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Expansion TypeDepth, Width
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Bus DirectionalUni-Directional
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Current - Supply (Max)80mA
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Voltage - Supply4.5 V ~ 5.5 V
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Access Time35ns
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Data Rate22.22MHz
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FunctionAsynchronous
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Memory Size4.5K (512 x 9)
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DigiKey ProgrammableNot Verified
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PackagingBulk
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Product StatusActive
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Series-
The SN74ACT7201LA35DV is a specific model of integrated circuit chip manufactured by Texas Instruments. It is a 32-bit universal bus transceiver with 3-state outputs. Here are some advantages and application scenarios of this chip:Advantages: 1. High-speed operation: The SN74ACT7201LA35DV operates at a high-speed of 35 nanoseconds, making it suitable for applications that require fast data transfer. 2. 3-state outputs: The chip has 3-state outputs, which means it can be put into a high-impedance state, allowing multiple devices to share the same bus without interfering with each other. 3. Wide operating voltage range: The chip can operate within a wide voltage range of 4.5V to 5.5V, making it compatible with various power supply systems. 4. Low power consumption: The SN74ACT7201LA35DV is designed to consume low power, making it suitable for battery-powered devices or applications where power efficiency is crucial.Application scenarios: 1. Data communication systems: The chip can be used in various data communication systems, such as UART (Universal Asynchronous Receiver-Transmitter) interfaces, where it can facilitate the transmission of data between different devices. 2. Memory systems: The SN74ACT7201LA35DV can be used in memory systems to enable data transfer between the memory modules and the processor or other devices. 3. Bus interfaces: It can be used as a bus transceiver in systems that require bidirectional data transfer between multiple devices, such as microcontrollers, FPGAs, or ASICs. 4. Industrial automation: The chip can be utilized in industrial automation systems where fast and reliable data transfer is required between different components or modules. 5. Embedded systems: It can be integrated into various embedded systems, such as robotics, automotive electronics, or IoT devices, to enable efficient data communication between different subsystems.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the overall system design.
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