SN74ACT7200L50RJR

SN74ACT7200L50RJR

Manufacturer No:

SN74ACT7200L50RJR

Manufacturer:

Texas Instruments

Description:

IC FIFO ASYNC 256X9 50NS 32PLCC

Datasheet:

Datasheet

Delivery:

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SN74ACT7200L50RJR Specifications

  • Type
    Parameter
  • Supplier Device Package
    32-PLCC
  • Package / Case
    32-LCC (J-Lead)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • FWFT Support
    No
  • Retransmit Capability
    Yes
  • Programmable Flags Support
    No
  • Expansion Type
    Depth, Width
  • Bus Directional
    Uni-Directional
  • Current - Supply (Max)
    80mA
  • Voltage - Supply
    4.5 V ~ 5.5 V
  • Access Time
    50ns
  • Data Rate
    15MHz
  • Function
    Asynchronous
  • Memory Size
    2.25K (256 x 9)
  • DigiKey Programmable
    Not Verified
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The SN74ACT7200L50RJR is a specific model of integrated circuit chip manufactured by Texas Instruments. It is a 16-bit buffer/driver with 3-state outputs. Here are some advantages and application scenarios of this chip:Advantages: 1. High-speed operation: The SN74ACT7200L50RJR chip operates at a high speed, making it suitable for applications that require fast data transfer and processing. 2. 3-state outputs: The chip has 3-state outputs, which means it can be set to high impedance state, allowing multiple devices to share a common bus without interfering with each other. 3. Wide operating voltage range: The chip can operate within a wide voltage range, typically between 4.5V and 5.5V, making it compatible with various power supply systems. 4. Low power consumption: The SN74ACT7200L50RJR chip is designed to consume low power, making it suitable for battery-powered devices or applications where power efficiency is crucial.Application scenarios: 1. Data communication systems: The high-speed operation and 3-state outputs of this chip make it suitable for use in data communication systems, such as UART (Universal Asynchronous Receiver-Transmitter) interfaces, where data needs to be transmitted and received at high speeds. 2. Memory systems: The chip can be used in memory systems, such as RAM (Random Access Memory) or ROM (Read-Only Memory), to buffer and drive data signals between the memory modules and the processor. 3. Bus interfaces: The 3-state outputs of the chip make it suitable for use in bus interfaces, where multiple devices need to share a common data bus. The chip can be used to buffer and drive data signals on the bus, ensuring proper data transfer and avoiding data conflicts. 4. Industrial automation: The high-speed operation and low power consumption of the chip make it suitable for use in industrial automation systems, where fast and efficient data processing is required.It's important to note that the specific advantages and application scenarios may vary depending on the requirements of the project and the overall system design.