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SN74V245-7PAG

SN74V245-7PAG

Manufacturer No:

SN74V245-7PAG

Manufacturer:

Texas Instruments

Description:

IC FIFO SYNC 4KX18 5NS 64TQFP

Datasheet:

Datasheet

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SN74V245-7PAG Specifications

  • Type
    Parameter
  • Supplier Device Package
    64-TQFP (10x10)
  • Package / Case
    64-TQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • FWFT Support
    Yes
  • Retransmit Capability
    No
  • Programmable Flags Support
    Yes
  • Expansion Type
    Depth, Width
  • Bus Directional
    Uni-Directional
  • Current - Supply (Max)
    35mA
  • Voltage - Supply
    3 V ~ 3.6 V
  • Access Time
    5ns
  • Data Rate
    133MHz
  • Function
    Synchronous
  • Memory Size
    72K (4K x 18)
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    74V
The SN74V245-7PAG is a specific model of integrated circuit chip, which is a bidirectional octal bus transceiver with 3-state outputs. Here are some advantages and application scenarios of this chip:Advantages: 1. Bidirectional communication: The chip allows data transmission in both directions, making it suitable for applications where data needs to be transferred between two systems or devices. 2. High-speed operation: The SN74V245-7PAG supports high-speed data transfer, making it suitable for applications that require fast communication. 3. 3-state outputs: The chip has 3-state outputs, which means it can be set to high impedance state, allowing multiple devices to share the same bus without interfering with each other. 4. Wide voltage range: The chip operates within a wide voltage range, making it compatible with various systems and devices.Application scenarios: 1. Data communication: The SN74V245-7PAG can be used in applications where data needs to be transferred between different systems or devices, such as in computer systems, networking equipment, or communication devices. 2. Bus interface: The chip can be used as a bus transceiver, allowing multiple devices to communicate over a shared bus. It is commonly used in systems that require bidirectional data transfer, such as in industrial automation, automotive electronics, or embedded systems. 3. Level shifting: The chip can be used to interface between systems or devices operating at different voltage levels. It can convert the voltage levels of signals, enabling communication between devices with different voltage requirements. 4. Buffering and isolation: The 3-state outputs of the chip can be used to buffer and isolate signals, preventing interference between different parts of a system or between multiple systems.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the overall system or device in which the chip is used.
SN74V245-7PAG Relevant information