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MC10EP33DTR2G

MC10EP33DTR2G

Manufacturer No:

MC10EP33DTR2G

Manufacturer:

onsemi

Description:

IC DIVIDER BY 4 1-BIT 8TSSOP

Datasheet:

Datasheet

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MC10EP33DTR2G Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-TSSOP
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3 V ~ 5.5 V
  • Trigger Type
    Positive, Negative
  • Count Rate
    4 GHz
  • Timing
    -
  • Reset
    Asynchronous
  • Number of Bits per Element
    2
  • Number of Elements
    1
  • Direction
    -
  • Logic Type
    Divide-by-4
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    10EP
The MC10EP33DTR2G is a high-speed differential receiver integrated circuit chip manufactured by ON Semiconductor. It is designed for applications that require high-speed signal transmission and reception. Here are some advantages and application scenarios of this chip:Advantages: 1. High-speed operation: The MC10EP33DTR2G is capable of operating at very high speeds, making it suitable for applications that require fast data transmission and reception. 2. Differential signaling: It uses differential signaling, which provides better noise immunity and reduces the effects of electromagnetic interference (EMI). 3. Low jitter: The chip has low jitter characteristics, ensuring accurate and reliable data transmission. 4. Wide operating voltage range: It can operate within a wide voltage range, making it compatible with various systems and applications. 5. Small form factor: The chip comes in a small package, allowing for easy integration into compact electronic devices.Application scenarios: 1. High-speed data communication: The MC10EP33DTR2G can be used in applications that require high-speed data transmission, such as telecommunications, networking, and data centers. 2. Clock and data recovery: It can be used in clock and data recovery circuits, where it receives high-speed clock and data signals and recovers the original clock and data information. 3. Test and measurement equipment: The chip can be used in high-speed test and measurement equipment, where it receives and processes high-frequency signals. 4. High-speed digital systems: It can be used in various high-speed digital systems, including high-speed data acquisition systems, digital oscilloscopes, and high-speed data recorders. 5. Fiber optic communication: The chip can be used in fiber optic communication systems, where it receives and processes high-speed optical signals converted into electrical signals.Overall, the MC10EP33DTR2G integrated circuit chip is suitable for applications that require high-speed signal reception, low jitter, and differential signaling.
MC10EP33DTR2G Relevant information