MC10EP32DR2

MC10EP32DR2

Manufacturer No:

MC10EP32DR2

Manufacturer:

onsemi

Description:

IC DIVIDER 1:2 ECL CLK IN 8-SOIC

Datasheet:

Datasheet

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MC10EP32DR2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3 V ~ 5.5 V
  • Trigger Type
    Positive, Negative
  • Count Rate
    4 GHz
  • Timing
    -
  • Reset
    Asynchronous
  • Number of Bits per Element
    1
  • Number of Elements
    1
  • Direction
    -
  • Logic Type
    Divide-by-2
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    10EP
The MC10EP32DR2 is a high-speed differential receiver integrated circuit chip manufactured by ON Semiconductor. It is part of the ECLinPS MAX family of devices and offers several advantages and application scenarios:Advantages: 1. High-speed operation: The MC10EP32DR2 is designed to operate at very high speeds, making it suitable for applications that require fast data transmission and processing. 2. Low jitter: It provides low jitter performance, ensuring accurate and reliable data reception. 3. Differential inputs: The chip has differential inputs, which allow it to receive signals with high common-mode noise rejection, reducing the impact of noise and interference. 4. Wide operating voltage range: It operates over a wide voltage range, typically from -3.0V to -5.5V, making it compatible with various power supply configurations. 5. Small form factor: The chip comes in a small package, making it suitable for space-constrained applications.Application scenarios: 1. High-speed data communication: The MC10EP32DR2 can be used in high-speed data communication systems, such as fiber-optic networks, where it receives and processes data signals at very high speeds. 2. Clock and data recovery: It can be employed in clock and data recovery circuits, where it receives clock and data signals and extracts the clock information accurately. 3. Test and measurement equipment: The chip can be utilized in test and measurement equipment that requires high-speed signal reception and processing, ensuring accurate measurements. 4. Data storage systems: It can be used in data storage systems, such as RAID controllers or solid-state drives, where it receives and processes high-speed data signals. 5. High-speed digital systems: The MC10EP32DR2 can be integrated into various high-speed digital systems, including high-performance computers, servers, and network switches, to receive and process high-speed data signals.It is important to note that the specific application scenarios may vary depending on the requirements and design considerations of the system in which the chip is being used.