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MC10EL33DTR2G

MC10EL33DTR2G

Manufacturer No:

MC10EL33DTR2G

Manufacturer:

onsemi

Description:

IC DIVIDER BY 4 1-BIT 8TSSOP

Datasheet:

Datasheet

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MC10EL33DTR2G Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-TSSOP
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    4.2 V ~ 5.7 V
  • Trigger Type
    Positive, Negative
  • Count Rate
    4.2 GHz
  • Timing
    -
  • Reset
    Asynchronous
  • Number of Bits per Element
    2
  • Number of Elements
    1
  • Direction
    -
  • Logic Type
    Divide-by-4
  • Packaging
    Bulk
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    10EL
The MC10EL33DTR2G is a high-speed differential receiver integrated circuit chip manufactured by ON Semiconductor. It is part of the ECLinPS MAX family of devices and offers several advantages and application scenarios:Advantages: 1. High-speed operation: The MC10EL33DTR2G is designed to operate at very high speeds, making it suitable for applications that require fast data transmission and processing. 2. Low jitter: It provides low jitter performance, ensuring accurate and reliable data reception. 3. Differential inputs: The chip has differential inputs, which allow it to receive differential signals and reject common-mode noise, enhancing signal integrity. 4. Wide operating voltage range: It can operate over a wide voltage range, typically from -4.2V to -5.7V, making it compatible with various power supply configurations. 5. Small package size: The chip is available in a small 8-pin SOIC package, enabling compact and space-constrained designs.Application scenarios: 1. High-speed data communication: The MC10EL33DTR2G can be used in applications that require high-speed data transmission, such as telecommunications, networking, and data centers. 2. Clock and data recovery: It can be employed in clock and data recovery circuits, where it receives high-speed clock and data signals and extracts the clock signal for synchronization purposes. 3. Test and measurement equipment: The chip can be utilized in test and measurement equipment that requires high-speed signal reception and processing. 4. Industrial automation: It can be integrated into industrial automation systems that demand fast and reliable data communication between different components. 5. High-speed digital design: The MC10EL33DTR2G can be used in the design of high-speed digital systems, such as FPGA and ASIC-based designs, to interface with other components and ensure accurate data reception.It is important to note that the specific application and implementation of the MC10EL33DTR2G may vary depending on the requirements and design considerations of the particular system.
MC10EL33DTR2G Relevant information