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MC10EL33DR2G

MC10EL33DR2G

Manufacturer No:

MC10EL33DR2G

Manufacturer:

onsemi

Description:

IC DIVIDER BY 4 1-BIT 8SOIC

Datasheet:

Datasheet

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MC10EL33DR2G Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    4.2 V ~ 5.7 V
  • Trigger Type
    Positive, Negative
  • Count Rate
    4.2 GHz
  • Timing
    -
  • Reset
    Asynchronous
  • Number of Bits per Element
    2
  • Number of Elements
    1
  • Direction
    -
  • Logic Type
    Divide-by-4
  • Packaging
    Bulk
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    10EL
The MC10EL33DR2G is a high-speed differential receiver integrated circuit chip manufactured by ON Semiconductor. It is part of the ECLinPS MAX family of devices and offers several advantages and application scenarios:Advantages: 1. High-speed operation: The MC10EL33DR2G is designed to operate at very high speeds, making it suitable for applications that require fast data transmission and processing. 2. Low jitter: It provides low jitter performance, ensuring accurate and reliable data reception. 3. Differential inputs: The chip has differential inputs, which allow it to receive signals with high common-mode noise rejection, reducing the impact of noise and interference. 4. Wide operating voltage range: It can operate within a wide voltage range, typically from -4.2V to -5.7V, making it compatible with various power supply configurations. 5. Small form factor: The chip comes in a small package, making it suitable for space-constrained applications.Application scenarios: 1. High-speed data communication: The MC10EL33DR2G can be used in high-speed data communication systems, such as fiber optic networks, where it receives differential signals and converts them into digital data. 2. Clock and data recovery: It can be employed in clock and data recovery circuits, where it receives high-speed clock and data signals and extracts the clock signal for synchronization purposes. 3. Test and measurement equipment: The chip can be utilized in test and measurement equipment that requires high-speed signal reception and processing, ensuring accurate measurements. 4. Data storage systems: It can be used in data storage systems, such as RAID controllers or disk drives, where it receives and processes high-speed data signals. 5. High-speed digital systems: The MC10EL33DR2G can be integrated into various high-speed digital systems, including servers, routers, and switches, to receive and process high-speed data signals.It is important to note that the specific application scenarios may vary depending on the requirements and design considerations of the overall system.
MC10EL33DR2G Relevant information