SY10EP33VZI-TR

SY10EP33VZI-TR

Manufacturer No:

SY10EP33VZI-TR

Manufacturer:

Microchip Technology

Description:

IC DIVIDER BY 4 1-BIT 8SOIC

Datasheet:

Datasheet

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SY10EP33VZI-TR Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3.3 V ~ 5 V
  • Trigger Type
    Positive, Negative
  • Count Rate
    4 GHz
  • Timing
    -
  • Reset
    Asynchronous
  • Number of Bits per Element
    2
  • Number of Elements
    1
  • Direction
    -
  • Logic Type
    Divide-by-4
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Discontinued at Digi-Key
  • Series
    10EP
The SY10EP33VZI-TR is a specific integrated circuit chip that belongs to the SY10EPxx series of high-speed, low-power ECL (Emitter-Coupled Logic) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. High-speed operation: The SY10EP33VZI-TR chip operates at very high speeds, making it suitable for applications that require fast data processing and transmission. 2. Low power consumption: It is designed to consume low power, making it energy-efficient and suitable for battery-powered devices or applications where power efficiency is crucial. 3. Wide operating voltage range: The chip can operate within a wide voltage range, typically between -3.0V and -5.5V, providing flexibility in various voltage level designs. 4. Differential inputs and outputs: The chip supports differential signaling, which helps in reducing noise and improving signal integrity in high-speed data transmission.Application scenarios: 1. Data communication systems: The SY10EP33VZI-TR chip can be used in high-speed data communication systems, such as fiber-optic networks, where fast and reliable data transmission is required. 2. Test and measurement equipment: It can be utilized in test and measurement instruments that deal with high-frequency signals, such as oscilloscopes, logic analyzers, or signal generators. 3. High-speed data processing: The chip can be employed in applications that involve high-speed data processing, such as digital signal processing (DSP), image processing, or real-time data analysis. 4. Clock distribution: Due to its high-speed capabilities, the chip can be used in clock distribution circuits, where precise and synchronized clock signals need to be distributed across multiple components or subsystems.It's important to note that the specific application scenarios may vary depending on the requirements and specifications of the overall system design.