SY100EL33ZC-TR

SY100EL33ZC-TR

Manufacturer No:

SY100EL33ZC-TR

Manufacturer:

Microchip Technology

Description:

IC DIVIDER BY 4 1-BIT 8SOIC

Datasheet:

Datasheet

Delivery:

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SY100EL33ZC-TR Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3.3 V ~ 5 V
  • Trigger Type
    Positive, Negative
  • Count Rate
    4.2 GHz
  • Timing
    -
  • Reset
    Asynchronous
  • Number of Bits per Element
    2
  • Number of Elements
    1
  • Direction
    -
  • Logic Type
    Divide-by-4
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Discontinued at Digi-Key
  • Series
    100EL
The SY100EL33ZC-TR is a specific integrated circuit chip that belongs to the SY100ELxx series of high-speed, low-power ECL (Emitter-Coupled Logic) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. High-speed operation: The SY100EL33ZC-TR chip operates at very high speeds, making it suitable for applications that require fast data processing and transmission. 2. Low power consumption: It is designed to consume low power, making it energy-efficient and suitable for battery-powered devices or applications where power efficiency is crucial. 3. Wide operating voltage range: The chip can operate over a wide voltage range, typically from -4.2V to -5.7V, allowing flexibility in different power supply configurations. 4. Differential inputs and outputs: The chip uses differential signaling, which provides better noise immunity and signal integrity, making it suitable for applications in noisy environments. 5. Small form factor: The chip comes in a small package, making it suitable for space-constrained applications or designs where miniaturization is required.Application scenarios: 1. Telecommunications: The high-speed operation and low power consumption of the SY100EL33ZC-TR chip make it suitable for telecommunications applications, such as high-speed data transmission, clock distribution, or signal conditioning in communication systems. 2. Data networking: The chip can be used in networking equipment, such as routers or switches, to handle high-speed data processing and transmission between different network components. 3. Test and measurement: The high-speed operation and differential signaling capability of the chip make it suitable for test and measurement applications, such as high-speed data acquisition, signal generation, or timing synchronization. 4. Industrial automation: The chip can be used in industrial automation systems, such as motor control, robotics, or high-speed data processing in manufacturing processes. 5. High-performance computing: The chip can be utilized in high-performance computing systems, such as servers or supercomputers, to handle high-speed data processing and communication between different computing nodes.It's important to note that the specific application scenarios may vary depending on the system requirements and the overall design.