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MC100LVEL33DT

MC100LVEL33DT

Manufacturer No:

MC100LVEL33DT

Manufacturer:

onsemi

Description:

IC DIVIDER DIV X4 ECL DFF 8TSSOP

Datasheet:

Datasheet

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MC100LVEL33DT Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-TSSOP
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3 V ~ 3.8 V
  • Trigger Type
    Positive, Negative
  • Count Rate
    4 GHz
  • Timing
    -
  • Reset
    Asynchronous
  • Number of Bits per Element
    2
  • Number of Elements
    1
  • Direction
    -
  • Logic Type
    Divide-by-4
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    100LVEL
The MC100LVEL33DT is a high-speed differential receiver integrated circuit chip. It is part of the MC100LVELxx series, which is designed for high-performance applications that require high-speed data transmission and low skew.Advantages of the MC100LVEL33DT chip:1. High-speed operation: The chip is capable of operating at very high frequencies, making it suitable for applications that require fast data transmission.2. Low skew: The chip has low output skew, which means that the time delay between the outputs is minimal. This is important in applications where precise timing is required.3. Differential inputs: The chip has differential inputs, which provide better noise immunity and common-mode rejection compared to single-ended inputs. This makes it suitable for applications in noisy environments.4. Wide operating voltage range: The chip can operate over a wide range of supply voltages, typically from -4.2V to -5.7V. This flexibility allows it to be used in various systems.Application scenarios of the MC100LVEL33DT chip:1. High-speed data communication: The chip can be used in high-speed data communication systems, such as fiber optic networks, where fast and reliable data transmission is required.2. Clock distribution: The chip's low skew and high-speed operation make it suitable for clock distribution applications, where precise timing synchronization is crucial.3. Test and measurement equipment: The chip can be used in test and measurement equipment that requires high-speed data acquisition and processing.4. Data storage systems: The chip can be used in data storage systems, such as RAID (Redundant Array of Independent Disks) controllers, where fast data transfer between storage devices is necessary.Overall, the MC100LVEL33DT chip is well-suited for applications that require high-speed data transmission, low skew, and reliable performance in noisy environments.
MC100LVEL33DT Relevant information