MC100EL33DT

MC100EL33DT

Manufacturer No:

MC100EL33DT

Manufacturer:

onsemi

Description:

IC DIVIDER DIV X4 ECL DFF 8TSSOP

Datasheet:

Datasheet

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MC100EL33DT Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-TSSOP
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    4.2 V ~ 5.7 V
  • Trigger Type
    Positive, Negative
  • Count Rate
    4.2 GHz
  • Timing
    -
  • Reset
    Asynchronous
  • Number of Bits per Element
    2
  • Number of Elements
    1
  • Direction
    -
  • Logic Type
    Divide-by-4
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    100EL
The MC100EL33DT is a high-speed, low-power ECL (Emitter-Coupled Logic) integrated circuit chip. It offers several advantages and can be used in various application scenarios. Here are some of the advantages and application scenarios of the MC100EL33DT:Advantages: 1. High-speed operation: The MC100EL33DT operates at very high speeds, making it suitable for applications that require fast data processing and transmission. 2. Low power consumption: It is designed to consume low power, making it energy-efficient and suitable for battery-powered devices or applications where power efficiency is crucial. 3. Differential inputs and outputs: The chip supports differential signaling, which provides better noise immunity and signal integrity, making it suitable for applications in noisy environments. 4. Wide operating voltage range: The MC100EL33DT can operate over a wide voltage range, typically from -5.2V to -3.8V, allowing flexibility in different power supply configurations. 5. Small form factor: The chip comes in a compact package, making it suitable for space-constrained applications.Application scenarios: 1. High-speed data communication: The MC100EL33DT can be used in high-speed data communication systems, such as fiber-optic networks, where fast and reliable data transmission is required. 2. Clock distribution: It can be used in clock distribution networks, where precise and synchronized clock signals need to be distributed across multiple components or subsystems. 3. Test and measurement equipment: The chip can be used in test and measurement equipment, such as oscilloscopes or logic analyzers, to process and analyze high-speed signals accurately. 4. Data storage systems: It can be used in data storage systems, such as RAID (Redundant Array of Independent Disks) controllers, to handle high-speed data transfers between storage devices and the host system. 5. High-performance computing: The MC100EL33DT can be used in high-performance computing systems, such as supercomputers or high-frequency trading platforms, to enable fast data processing and communication between different components.These are just a few examples of the advantages and application scenarios of the MC100EL33DT. The chip's high-speed operation, low power consumption, and differential signaling capabilities make it suitable for various applications that require fast and reliable data processing and transmission.