MC10EL32DR2G

MC10EL32DR2G

Manufacturer No:

MC10EL32DR2G

Manufacturer:

onsemi

Description:

IC DIVIDER BY 2 1-BIT 8SOIC

Datasheet:

Datasheet

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MC10EL32DR2G Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    4.2 V ~ 5.7 V
  • Trigger Type
    Positive, Negative
  • Count Rate
    3 GHz
  • Timing
    -
  • Reset
    Asynchronous
  • Number of Bits per Element
    1
  • Number of Elements
    1
  • Direction
    Up
  • Logic Type
    Divide-by-2
  • Packaging
    Bulk
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    10EL
The MC10EL32DR2G is a high-speed differential receiver integrated circuit chip manufactured by ON Semiconductor. It is part of the ECLinPS MAX family of devices and offers several advantages and application scenarios:Advantages: 1. High-speed operation: The MC10EL32DR2G is designed to operate at very high speeds, making it suitable for applications that require fast data transmission and processing. 2. Low power consumption: It has low power dissipation, making it energy-efficient and suitable for battery-powered devices or applications where power consumption is a concern. 3. Differential signaling: The chip uses differential signaling, which provides better noise immunity and common-mode rejection, resulting in improved signal integrity and reliability. 4. Wide operating voltage range: It can operate over a wide voltage range, typically from -4.2V to -5.7V, allowing flexibility in different power supply configurations. 5. Small form factor: The chip comes in a small package, making it suitable for space-constrained applications or integration into compact electronic devices.Application scenarios: 1. High-speed data communication: The MC10EL32DR2G can be used in applications that require high-speed data transmission, such as telecommunications, networking, and data centers. 2. Clock and data distribution: It can be used for clock and data distribution in systems that require precise synchronization, such as high-performance computing, test and measurement equipment, and radar systems. 3. Signal conditioning: The chip can be used for signal conditioning and amplification in applications that require high-speed signal processing, such as oscilloscopes, spectrum analyzers, and high-frequency test equipment. 4. Industrial automation: It can be used in industrial automation systems that require high-speed and reliable communication between different components or subsystems. 5. Medical devices: The chip can be used in medical devices that require high-speed data processing and communication, such as imaging systems, patient monitoring equipment, and diagnostic instruments.These are just a few examples of the advantages and application scenarios of the MC10EL32DR2G integrated circuit chips. The specific use cases may vary depending on the requirements of the application and the system design.