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MC10EP33DR2G

MC10EP33DR2G

Manufacturer No:

MC10EP33DR2G

Manufacturer:

onsemi

Description:

IC DIVIDER BY 4 1-BIT 8SOIC

Datasheet:

Datasheet

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MC10EP33DR2G Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3 V ~ 5.5 V
  • Trigger Type
    Positive, Negative
  • Count Rate
    4 GHz
  • Timing
    -
  • Reset
    Asynchronous
  • Number of Bits per Element
    2
  • Number of Elements
    1
  • Direction
    -
  • Logic Type
    Divide-by-4
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    10EP
The MC10EP33DR2G is a high-speed differential receiver integrated circuit chip manufactured by ON Semiconductor. It is designed for applications that require high-speed data transmission and reception. Here are some advantages and application scenarios of the MC10EP33DR2G:Advantages: 1. High-speed operation: The chip operates at very high speeds, making it suitable for applications that require fast data transmission and reception. 2. Differential signaling: It uses differential signaling, which provides better noise immunity and reduces the effects of electromagnetic interference (EMI). 3. Low jitter: The chip has low jitter, ensuring accurate and reliable data transmission. 4. Wide operating voltage range: It can operate within a wide voltage range, making it compatible with various systems and applications. 5. Small form factor: The chip comes in a small package, making it suitable for space-constrained applications.Application scenarios: 1. High-speed data communication: The MC10EP33DR2G can be used in high-speed data communication systems, such as fiber optic networks, Ethernet, and high-speed serial interfaces. 2. Telecommunications: It can be used in telecommunications equipment, such as routers, switches, and high-speed data links. 3. Test and measurement: The chip can be used in test and measurement equipment that requires high-speed data acquisition and analysis. 4. Data centers: It can be used in data centers for high-speed data transmission and reception between servers, switches, and storage devices. 5. Industrial automation: The chip can be used in industrial automation systems that require high-speed data communication between various components.Overall, the MC10EP33DR2G integrated circuit chip offers high-speed, reliable, and accurate data transmission and reception, making it suitable for a wide range of applications that require high-speed data communication.
MC10EP33DR2G Relevant information