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MC10EP33DG

MC10EP33DG

Manufacturer No:

MC10EP33DG

Manufacturer:

onsemi

Description:

IC DIVIDER BY 4 1-BIT 8SOIC

Datasheet:

Datasheet

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MC10EP33DG Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3 V ~ 5.5 V
  • Trigger Type
    Positive, Negative
  • Count Rate
    4 GHz
  • Timing
    -
  • Reset
    Asynchronous
  • Number of Bits per Element
    2
  • Number of Elements
    1
  • Direction
    -
  • Logic Type
    Divide-by-4
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    10EP
The MC10EP33DG is a high-speed differential receiver integrated circuit chip manufactured by ON Semiconductor. It is designed for applications that require high-speed signal transmission and reception. Here are some advantages and application scenarios of the MC10EP33DG:Advantages: 1. High-speed operation: The MC10EP33DG operates at very high speeds, making it suitable for applications that require fast data transmission and reception. 2. Differential signaling: It uses differential signaling, which provides better noise immunity and common-mode rejection, resulting in improved signal integrity. 3. Low jitter: The chip has low jitter characteristics, ensuring accurate and reliable data transmission. 4. Wide operating voltage range: It can operate over a wide voltage range, typically from -3.0V to -5.5V, making it compatible with various systems and power supplies. 5. Small form factor: The chip comes in a small package, making it suitable for space-constrained applications.Application scenarios: 1. High-speed data communication: The MC10EP33DG can be used in high-speed data communication systems, such as fiber-optic networks, where fast and reliable data transmission is crucial. 2. Telecommunications: It can be used in telecommunications equipment, such as routers, switches, and high-speed data links, to ensure accurate signal reception and transmission. 3. Test and measurement equipment: The chip can be used in high-speed test and measurement equipment, such as oscilloscopes and logic analyzers, to capture and analyze high-speed signals accurately. 4. Data centers: It can be used in data center equipment, such as servers and storage systems, to handle high-speed data transmission between different components. 5. Industrial applications: The MC10EP33DG can be used in industrial automation systems, where high-speed data transmission is required for control and monitoring purposes.Overall, the MC10EP33DG integrated circuit chip offers high-speed, low-jitter, and differential signaling capabilities, making it suitable for various applications that require fast and reliable data transmission and reception.
MC10EP33DG Relevant information